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LM3S2948-IQC50-A2

Texas Instruments

LM3S2948-IQC50-A2 by Texas Instruments

Texas Instruments LM3S2948-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 65536 bytes RAM, and 262144 ROM words. With CAN, I2C, SSI, UART connectivity options and 8-channel ADCs for industrial applications requiring low power mode and high-speed processing up to 50 MHz.

Median Price

$139.520

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 49 parts In-Stock

1+ parts

$139.520

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49

$139.520

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Digiode

USA . 3,818 parts In-Stock

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3,818

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Vyrian

USA . 3,308 parts In-Stock

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3,308

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 823 parts In-Stock

1+ parts

$3.000

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823

$3.000

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AZTECH Wire

Italy . 480 parts In-Stock

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$5.719

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480

$5.719

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$28.379

100+ parts

$25.825

1k+ parts

$23.271

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-

2,500

$28.379

$25.825

$23.271

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Parana Technologies

USA . 1,140 parts In-Stock

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$38.419

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1,140

$38.419

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DigiPath Technology Company

USA . 568 parts In-Stock

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$42.304

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568

$42.304

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IDEA Electronic Components Group

UK . 1,387 parts In-Stock

1+ parts

$43.167

100+ parts

$41.009

1k+ parts

$38.850

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1,387

$43.167

$41.009

$38.850

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ChromeModa Solutions

Germany . 1,242 parts In-Stock

1+ parts

$43.167

100+ parts

$35.397

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$43.167

$35.397

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Microchip USA

USA . 2,425 parts In-Stock

1+ parts

$56.420

100+ parts

$55.440

1k+ parts

$54.950

10k+ parts

$54.460

2,425

$56.420

$55.440

$54.950

$54.460

Lixinc

USA . 13,064 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,639 parts In-Stock

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Kepictronics

USA . 420 parts In-Stock

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420

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Overview

Discover the LM3S2948-IQC50-A2 by Texas Instruments, a high-quality microcontroller designed to meet your application needs. With Texas Instruments' reputation for excellence in manufacturing, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller provides value through its integrated cache, advanced peripherals, and low power mode capabilities. Experience the benefits of seamless connectivity, efficient operation, and innovative features with the LM3S2948-IQC50-A2. Elevate your projects with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and versatile packaging material for long-term use

Integrated Cache: YES

Improves processing speed by storing frequently accessed data

Maximum Supply Voltage: 2.75 V

Efficient power consumption and compatibility with lower voltage systems

No. of Terminals: 100

Offers a wide range of connectivity options for various applications

CPU Family: CORTEX-M3

Utilizes advanced ARM architecture for high performance

RAM Bytes: 65536

Sufficient memory space for data processing and storage

ADC Channels: YES

Allows for analog-to-digital conversion for sensor integration

Connectivity: CAN(2), I2C, SSI(2), UART(3)

Supports a wide range of communication protocols for flexibility in connectivity

Low Power Mode: YES

Enables energy-efficient operation and extended battery life

Moisture Sensitivity Level (MSL): 3

Suitable for industrial environments with moderate moisture exposure

Technical Specifications

Microcontrollers LM3S2948-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C, SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S2948-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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