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LM3S2948-IBZ50-A2

Texas Instruments

LM3S2948-IBZ50-A2 by Texas Instruments

LM3S2948-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 50 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of grid array and low profile, it offers versatile connectivity options for various electronic systems.

Median Price

$14.588

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 936 parts In-Stock

1+ parts

-

100+ parts

$11.670

1k+ parts

$10.440

10k+ parts

$9.820

936

-

$11.670

$10.440

$9.820

DigiKey

USA . 936 parts In-Stock

1+ parts

-

100+ parts

$15.350

1k+ parts

-

10k+ parts

-

936

-

$15.350

-

-

Verical

USA . 736 parts In-Stock

1+ parts

-

100+ parts

$14.588

1k+ parts

$13.050

10k+ parts

$12.275

736

-

$14.588

$13.050

$12.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,071 parts In-Stock

1+ parts

$12.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,071

$12.312

-

-

-

Vyrian

USA . 6,434 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,434

-

-

-

-

DigiKey Marketplace

USA . 936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

936

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,897 parts In-Stock

1+ parts

$11.664

100+ parts

-

1k+ parts

-

10k+ parts

-

4,897

$11.664

-

-

-

Microchip USA

USA . 1,338 parts In-Stock

1+ parts

$49.050

100+ parts

$48.350

1k+ parts

$48.000

10k+ parts

$47.650

1,338

$49.050

$48.350

$48.000

$47.650

Parana Technologies

USA . 1,229 parts In-Stock

1+ parts

$59.447

100+ parts

-

1k+ parts

-

10k+ parts

-

1,229

$59.447

-

-

-

ChromeModa Solutions

Germany . 4,864 parts In-Stock

1+ parts

$66.794

100+ parts

$54.771

1k+ parts

-

10k+ parts

-

4,864

$66.794

$54.771

-

-

IDEA Electronic Components Group

UK . 673 parts In-Stock

1+ parts

$66.794

100+ parts

$63.454

1k+ parts

$60.115

10k+ parts

-

673

$66.794

$63.454

$60.115

-

Kepictronics

USA . 936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

936

-

-

-

-

DigiPath Technology Company

USA . 223 parts In-Stock

1+ parts

-

100+ parts

$60.221

1k+ parts

-

10k+ parts

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223

-

$60.221

-

-

Overview

Discover the LM3S2948-IBZ50-A2 by Texas Instruments, a top-notch microcontroller that sets new standards in performance and reliability. With a 32-bit architecture and advanced technology, this device is perfect for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched value and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects with the LM3S2948-IBZ50-A2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package lightweight and durable, suitable for portable and long-lasting applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.75 V

With a low maximum supply voltage, this microcontroller is suitable for low-power applications, helping to conserve energy.

Bit Size: 32

32-bit architecture enables efficient processing and data handling, ideal for complex tasks and high-performance applications.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with different power sources.

No. of Terminals: 108

Ample terminals allow for versatile connectivity options and interfaces, enhancing the microcontroller's functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various environments and conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing and storage conditions.

Technical Specifications

Microcontrollers LM3S2948-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2948-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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