Loading...

LM3S2939-IQC50-A2

Texas Instruments

LM3S2939-IQC50-A2 by Texas Instruments

Texas Instruments' LM3S2939-IQC50-A2 microcontroller features 32-bit architecture, 262144 ROM words, and 65536 RAM bytes. With a clock frequency of 0.032 MHz, it is ideal for industrial applications requiring high-speed processing and multiple PWM channels. The compact square package with a flatpack style makes it suitable for space-constrained designs.

Median Price

$13.662

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 172 parts In-Stock

1+ parts

-

100+ parts

$10.930

1k+ parts

$9.780

10k+ parts

$9.210

172

-

$10.930

$9.780

$9.210

DigiKey

USA . 172 parts In-Stock

1+ parts

-

100+ parts

$14.390

1k+ parts

-

10k+ parts

-

172

-

$14.390

-

-

Verical

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$13.662

1k+ parts

$12.225

10k+ parts

$11.512

90

-

$13.662

$12.225

$11.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,042 parts In-Stock

1+ parts

$11.552

100+ parts

-

1k+ parts

-

10k+ parts

-

2,042

$11.552

-

-

-

Vyrian

USA . 7,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,368

-

-

-

-

DigiKey Marketplace

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,495 parts In-Stock

1+ parts

$10.944

100+ parts

-

1k+ parts

-

10k+ parts

-

2,495

$10.944

-

-

-

Parana Technologies

USA . 86 parts In-Stock

1+ parts

$29.484

100+ parts

-

1k+ parts

$59.884

10k+ parts

-

86

$29.484

-

$59.884

-

DigiPath Technology Company

USA . 1,989 parts In-Stock

1+ parts

$32.465

100+ parts

$29.868

1k+ parts

-

10k+ parts

-

1,989

$32.465

$29.868

-

-

ChromeModa Solutions

Germany . 2,422 parts In-Stock

1+ parts

$33.128

100+ parts

$27.165

1k+ parts

-

10k+ parts

-

2,422

$33.128

$27.165

-

-

IDEA Electronic Components Group

UK . 586 parts In-Stock

1+ parts

$33.128

100+ parts

$31.472

1k+ parts

$29.815

10k+ parts

-

586

$33.128

$31.472

$29.815

-

Microchip USA

USA . 2,879 parts In-Stock

1+ parts

$46.030

100+ parts

$45.370

1k+ parts

$45.040

10k+ parts

$44.710

2,879

$46.030

$45.370

$45.040

$44.710

Kepictronics

USA . 89 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

89

-

-

-

-

Overview

Elevate your projects with the LM3S2939-IQC50-A2 microcontroller by Texas Instruments. Crafted with precision and quality, this versatile device opens up a world of possibilities in various applications, from industrial automation to consumer electronics. With cutting-edge technology and reliable performance, this microcontroller offers unparalleled value and benefits to customers seeking efficiency and innovation. Experience the difference with Texas Instruments and take your creations to the next level with the LM3S2939-IQC50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, ensuring reliable performance.

Package Shape: SQUARE

Square shape aids in space-saving design and placement on the PCB.

Bit Size: 32

Higher bit size allows for more complex operations and calculations to be performed by the microcontroller.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, offering flexibility in system design.

No. of Terminals: 100

Sufficient number of terminals for connecting various external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style enhances thermal performance and ease of PCB integration.

Minimum Supply Voltage: 2.25 V

Wide voltage range allows for operation in varying voltage conditions.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments without performance degradation.

Terminal Finish: TIN

Tin finish provides good electrical conductivity and corrosion resistance.

ADC Channels: YES

Includes analog-to-digital converter channels for reading analog inputs, essential for sensor interfacing.

Terminal Position: QUAD

Quad terminal position allows for easy and secure soldering onto the PCB.

ROM Words: 262144

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim device integration.

Width: 14 mm

Moderate width for balance between space-saving and ease of handling during assembly.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for fast processing speeds and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable solder joints.

Length: 14 mm

Compact length for space-efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and fast processing capabilities.

RAM Bytes: 65536

Ample RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and good electrical contact.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Supports Pulse Width Modulation channels for precise control of digital signals.

ROM Programmability: FLASH

Flash ROM can be easily reprogrammed for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layout and miniaturization.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions.

Speed: 50 rpm

Operates at a moderate speed suitable for microcontroller applications.

No. of I/O Lines: 57

Sufficient number of input/output lines for connecting external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2939-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

57

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2939-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20