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LM3S2939-IBZ50-A2

Texas Instruments

LM3S2939-IBZ50-A2 by Texas Instruments

LM3S2939-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile connectivity options in compact dimensions.

Median Price

$13.662

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$10.930

1k+ parts

$9.780

10k+ parts

$9.210

552

-

$10.930

$9.780

$9.210

DigiKey

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$14.390

1k+ parts

-

10k+ parts

-

552

-

$14.390

-

-

Verical

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$13.662

1k+ parts

$12.950

10k+ parts

-

552

-

$13.662

$12.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,246 parts In-Stock

1+ parts

$11.552

100+ parts

-

1k+ parts

-

10k+ parts

-

2,246

$11.552

-

-

-

Vyrian

USA . 8,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,568

-

-

-

-

DigiKey Marketplace

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

552

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,425 parts In-Stock

1+ parts

$10.944

100+ parts

-

1k+ parts

-

10k+ parts

-

2,425

$10.944

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$28.498

100+ parts

$25.933

1k+ parts

$23.368

10k+ parts

-

5,000

$28.498

$25.933

$23.368

-

Microchip USA

USA . 1,476 parts In-Stock

1+ parts

$46.030

100+ parts

$45.370

1k+ parts

$45.040

10k+ parts

$44.710

1,476

$46.030

$45.370

$45.040

$44.710

Parana Technologies

USA . 738 parts In-Stock

1+ parts

$54.389

100+ parts

-

1k+ parts

-

10k+ parts

-

738

$54.389

-

-

-

ChromeModa Solutions

Germany . 3,639 parts In-Stock

1+ parts

$61.111

100+ parts

$50.111

1k+ parts

-

10k+ parts

-

3,639

$61.111

$50.111

-

-

IDEA Electronic Components Group

UK . 1,795 parts In-Stock

1+ parts

$61.111

100+ parts

$58.055

1k+ parts

$55.000

10k+ parts

-

1,795

$61.111

$58.055

$55.000

-

DigiPath Technology Company

USA . 33 parts In-Stock

1+ parts

-

100+ parts

$55.098

1k+ parts

-

10k+ parts

-

33

-

$55.098

-

-

Overview

Unlock the power of innovation with the LM3S2939-IBZ50-A2 microcontroller by Texas Instruments. Crafted with precision and excellence, this device offers unparalleled performance and reliability for a wide range of applications. Whether you're looking to create cutting-edge electronics or streamline your industrial processes, this microcontroller delivers value, efficiency, and flexibility. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements.

Surface Mount: YES

Surface mount capability makes it easy to integrate into PCB designs.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a low maximum supply voltage limit.

Package Shape: SQUARE

Square shape allows for easy placement and alignment on the PCB.

Bit Size: 32

32-bit architecture provides high processing power and performance.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 108

Provides ample terminals for connectivity and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient use of space on the PCB.

Minimum Supply Voltage: 2.25 V

Operates reliably even at low minimum supply voltage levels.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand low operating temperatures for versatility in usage.

Terminal Finish: TIN SILVER COPPER

Terminal finish provides good conductivity and corrosion resistance.

ADC Channels: YES

Analog-to-digital converter channels allow for sensing and data acquisition.

Terminal Position: BOTTOM

Bottom terminal position helps in easy soldering and connection in the circuit.

ROM Words: 262144

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Low profile design with a maximum seated height of 1.5mm for space-saving.

Width: 10 mm

Compact width for efficient PCB layout and space management.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds during manufacturing processes.

Peak Reflow Temperature °C: 260

Ability to endure high peak reflow temperature during assembly.

Length: 10 mm

Compact length for efficient PCB design and space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture for efficient processing.

RAM Bytes: 65536

Large RAM capacity for temporary data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable connectivity and soldering.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) channels for precise control and signaling.

ROM Programmability: FLASH

Flash ROM programmability for flexible memory allocation and reprogramming.

Terminal Pitch: 0.8 mm

Narrow terminal pitch for compact PCB design and layout.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling.

Speed: 50 rpm

Operates at a speed of 50 rotations per minute for consistent performance.

No. of I/O Lines: 57

Ample input/output lines for connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers LM3S2939-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

57

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2939-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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