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LM3S2939-EQC50-A2T

Texas Instruments

LM3S2939-EQC50-A2T by Texas Instruments

LM3S2939-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates b/w -40 to 105 °C, has PWM channels, and offers 57 I/O lines. Ideal for industrial applications requiring a max clock frequency of 0.032 MHz in a compact FLATPACK package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,189 parts In-Stock

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Digiode

USA . 910 parts In-Stock

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910

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Distributors (Availability)

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AZTECH Wire

Italy . 300 parts In-Stock

1+ parts

$16.235

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300

$16.235

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One Stop Electronics

USA . 1,468 parts In-Stock

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$28.000

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$28.000

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Parana Technologies

USA . 1,857 parts In-Stock

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$67.541

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1,857

$67.541

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DigiPath Technology Company

USA . 810 parts In-Stock

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$74.371

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$68.422

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810

$74.371

$68.422

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ChromeModa Solutions

Germany . 2,782 parts In-Stock

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$75.889

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$62.229

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2,782

$75.889

$62.229

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IDEA Electronic Components Group

UK . 447 parts In-Stock

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$75.889

100+ parts

$72.095

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$68.300

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447

$75.889

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$68.300

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Corphita

USA . 4,422 parts In-Stock

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Microchip USA

USA . 180 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the Texas Instruments LM3S2939-EQC50-A2T microcontroller. This innovative device, crafted with precision by a trusted leader in the industry, offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides seamless integration, high-speed processing, and efficient power management. Elevate your projects to the next level with the LM3S2939-EQC50-A2T and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for use in various applications without adding extra weight.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the microcontroller onto circuit boards, reducing production time and costs.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75 V, this microcontroller is energy-efficient and can operate within a low power consumption range, making it suitable for battery-powered devices.

Package Shape: SQUARE

The square package shape saves space on circuit boards, allowing for more components to be integrated into a smaller area, making it suitable for compact designs.

Bit Size: 32

A 32-bit microcontroller offers higher processing power and performance compared to lower bit sizes, suitable for handling complex tasks and applications efficiently.

No. of Terminals: 100

Having 100 terminals provides ample connection points for interfacing with external components and peripherals, allowing for greater flexibility in design and functionality.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can withstand harsh environmental conditions and temperature fluctuations, ensuring reliability in various applications.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and devices, expanding its range of potential applications.

ROM Words: 262144

A large ROM capacity of 262144 words provides ample storage for program code and data, allowing for more complex algorithms and applications to be implemented on the microcontroller.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures the microcontroller can operate reliably in demanding environments with varying temperature conditions, making it suitable for industrial applications.

Technical Specifications

Microcontrollers LM3S2939-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

57

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2939-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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