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LM3S2918-IBZ50-A2

Texas Instruments

LM3S2918-IBZ50-A2 by Texas Instruments

LM3S2918-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, making it ideal for industrial applications requiring high-speed processing and control capabilities. With 52 I/O lines and PWM channels, this microcontroller offers versatile connectivity options for various electronic systems.

Median Price

$13.375

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$10.700

1k+ parts

$9.570

10k+ parts

$9.010

552

-

$10.700

$9.570

$9.010

DigiKey

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$14.080

1k+ parts

-

10k+ parts

-

552

-

$14.080

-

-

Verical

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$13.375

1k+ parts

$12.662

10k+ parts

-

552

-

$13.375

$12.662

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,729 parts In-Stock

1+ parts

$11.296

100+ parts

-

1k+ parts

-

10k+ parts

-

4,729

$11.296

-

-

-

Vyrian

USA . 7,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,107

-

-

-

-

DigiKey Marketplace

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

552

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,410 parts In-Stock

1+ parts

$10.701

100+ parts

-

1k+ parts

-

10k+ parts

-

1,410

$10.701

-

-

-

Component Stockers USA

USA . 73 parts In-Stock

1+ parts

$12.300

100+ parts

$11.560

1k+ parts

-

10k+ parts

-

73

$12.300

$11.560

-

-

Microchip USA

USA . 393 parts In-Stock

1+ parts

$45.000

100+ parts

$44.360

1k+ parts

$44.040

10k+ parts

$43.720

393

$45.000

$44.360

$44.040

$43.720

Parana Technologies

USA . 851 parts In-Stock

1+ parts

$71.198

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$71.198

-

-

-

DigiPath Technology Company

USA . 1,694 parts In-Stock

1+ parts

$78.398

100+ parts

$72.126

1k+ parts

-

10k+ parts

-

1,694

$78.398

$72.126

-

-

ChromeModa Solutions

Germany . 3,000 parts In-Stock

1+ parts

$79.998

100+ parts

$65.598

1k+ parts

-

10k+ parts

-

3,000

$79.998

$65.598

-

-

IDEA Electronic Components Group

UK . 376 parts In-Stock

1+ parts

$79.998

100+ parts

$75.998

1k+ parts

$71.998

10k+ parts

-

376

$79.998

$75.998

$71.998

-

Overview

Unlock the power of innovation with the LM3S2918-IBZ50-A2 by Texas Instruments. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this product delivers exceptional value to customers seeking top-notch performance and versatility. Experience seamless integration, advanced features, and superior efficiency with the LM3S2918-IBZ50-A2 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability and ease of handling.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto a PCB, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 2.75 V

A higher maximum supply voltage provides flexibility in power input options while still staying within a safe operating range.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, ideal for applications where board real estate is limited.

Bit Size: 32

A larger bit size allows for more complex processing and calculations, making this microcontroller suitable for handling advanced tasks.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options gives flexibility in design and compatibility with various power sources.

No. of Terminals: 108

A higher number of terminals allow for more connections and functionalities, making this microcontroller versatile for different applications.

Package Style (Meter): GRID ARRAY

The grid array package style ensures reliable connections and efficient heat dissipation, critical for high-performance applications.

Minimum Supply Voltage: 2.25 V

Having a low minimum supply voltage allows for operation in low power conditions, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microcontroller suitable for a wide range of applications, including industrial and automotive.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities.

Terminal Position: BOTTOM

Bottom terminal positioning allows for easier PCB layout and assembly, optimizing space utilization and enhancing design flexibility.

ROM Words: 262144

With a large ROM capacity, this microcontroller can store complex programs and data, making it suitable for diverse application requirements.

Maximum Seated Height: 1.5 mm

The low seated height allows for compact designs and slim form factors, ideal for space-constrained applications.

Width: 10 mm

The compact width of the microcontroller enables efficient PCB layout and minimizes space usage, critical for small-scale electronic devices.

Maximum Clock Frequency: 8.192 MHz

A high maximum clock frequency allows for fast data processing and real-time operation, making this microcontroller suitable for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper soldering without damaging the microcontroller, facilitating reliable assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables robust soldering processes, ensuring secure connections and long-term durability.

Length: 10 mm

The compact length of the microcontroller facilitates space-efficient PCB design, ideal for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments, making this microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of RISC architecture in a microcontroller offers high performance, low power consumption, and efficient code execution, ideal for embedded systems.

RAM Bytes: 65536

With a large RAM capacity, this microcontroller can efficiently handle data processing and storage, enabling complex computational tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this microcontroller energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides reliable connections and easy soldering, ensuring robust interconnection with the PCB for stable performance.

Nominal Supply Voltage: 2.5 V

Having a consistent nominal supply voltage simplifies power management and ensures reliable operation within specified voltage levels.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog devices, making this microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

The flash ROM programmability feature enables easy updating and modification of firmware, enhancing flexibility and adaptability in application development.

Terminal Pitch: 0.8 mm

The small terminal pitch provides high-density packaging and efficient use of PCB real estate, critical for space-constrained designs.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring reliability in varied environmental conditions.

Speed: 50 rpm

The speed specification indicates the rotational speed of a motor interface, making this microcontroller suitable for motor control and automation applications.

No. of I/O Lines: 52

A high number of I/O lines enables versatile interfacing capabilities, allowing the microcontroller to communicate with various external devices and systems.

Technical Specifications

Microcontrollers LM3S2918-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2918-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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