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LM3S2918-EQC50-A2T

Texas Instruments

LM3S2918-EQC50-A2T by Texas Instruments

LM3S2918-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 8.192 MHz, it features 52 I/O lines and PWM channels for industrial applications requiring high-speed processing and control capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,066 parts In-Stock

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4,066

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Digiode

USA . 2,779 parts In-Stock

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2,779

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Distributors (Availability)

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AZTECH Wire

Italy . 832 parts In-Stock

1+ parts

$8.384

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832

$8.384

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One Stop Electronics

USA . 1,030 parts In-Stock

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$29.000

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$29.000

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Parana Technologies

USA . 1,103 parts In-Stock

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$61.200

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1,103

$61.200

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DigiPath Technology Company

USA . 1,837 parts In-Stock

1+ parts

$67.389

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$61.998

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1,837

$67.389

$61.998

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ChromeModa Solutions

Germany . 4,796 parts In-Stock

1+ parts

$68.764

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$56.386

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4,796

$68.764

$56.386

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IDEA Electronic Components Group

UK . 1,008 parts In-Stock

1+ parts

$68.764

100+ parts

$65.326

1k+ parts

$61.888

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1,008

$68.764

$65.326

$61.888

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Corphita

USA . 4,824 parts In-Stock

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Microchip USA

USA . 417 parts In-Stock

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Overview

Unlock a world of endless possibilities with the LM3S2918-EQC50-A2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering unmatched performance and efficiency. Whether you're a seasoned professional or a hobbyist looking to take your projects to the next level, the LM3S2918-EQC50-A2T provides the value, benefits, and advantages you need to succeed. Experience innovation at its finest with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 2.75 V

Allows for efficient power consumption and compatibility with lower voltage systems.

Bit Size: 32

Offers sufficient processing power and capability for a wide range of applications.

Power Supplies (V): 2.5,3.3

Provides flexibility in power options for different system requirements.

No. of Terminals: 100

Offers ample connectivity for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Enables easy integration into electronic devices with a compact form factor.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, expanding its usability.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Allows for analog input monitoring, enabling a wider range of sensor integration.

ROM Words: 262144

Ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact size for easy PCB layout and design.

Maximum Clock Frequency: 8.192 MHz

Offers high-speed processing capabilities for demanding tasks.

Length: 14 mm

Compact form factor for integration in small electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing and control.

RAM Bytes: 65536

Sufficient RAM capacity for data storage and manipulation.

Technology: CMOS

Low power consumption and reliable operation in various conditions.

Terminal Form: GULL WING

Facilitates easy soldering and connection to PCBs.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Supports Pulse Width Modulation for precise control over output signals.

ROM Programmability: FLASH

Allows for easy reprogramming of ROM, enabling flexibility in applications.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

Suitable for environments with moderate exposure to moisture.

Speed: 50 rpm

Capable of handling fast processing speeds for real-time applications.

No. of I/O Lines: 52

Sufficient I/O capability for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2918-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2918-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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