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LM3S2918-EQC50-A2

Texas Instruments

LM3S2918-EQC50-A2 by Texas Instruments

LM3S2918-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 8.192 MHz, it features 52 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,241 parts In-Stock

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7,241

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Digiode

USA . 456 parts In-Stock

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456

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Distributors (Availability)

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AZTECH Wire

Italy . 388 parts In-Stock

1+ parts

$8.795

100+ parts

-

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388

$8.795

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One Stop Electronics

USA . 348 parts In-Stock

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$10.000

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348

$10.000

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Parana Technologies

USA . 2,271 parts In-Stock

1+ parts

$35.584

100+ parts

$3,304.512

1k+ parts

$32.026

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2,271

$35.584

$3,304.512

$32.026

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DigiPath Technology Company

USA . 2,201 parts In-Stock

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$39.182

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2,201

$39.182

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ChromeModa Solutions

Germany . 3,316 parts In-Stock

1+ parts

$39.982

100+ parts

$32.785

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3,316

$39.982

$32.785

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IDEA Electronic Components Group

UK . 1,758 parts In-Stock

1+ parts

$39.982

100+ parts

$37.983

1k+ parts

$35.984

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1,758

$39.982

$37.983

$35.984

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Corphita

USA . 2,823 parts In-Stock

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Microchip USA

USA . 294 parts In-Stock

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294

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Overview

Unlock the power of innovation with the LM3S2918-EQC50-A2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers for a wide range of applications. This versatile product offers customers unmatched value and benefits, including high performance, reliability, and efficiency. Whether you're working on industrial automation, consumer electronics, or IoT devices, the LM3S2918-EQC50-A2 is the perfect solution to bring your projects to life. Elevate your designs and stay ahead of the competition with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and ability to protect the components inside.

Surface Mount: YES

Surface mount technology allows for compact design and easy PCB assembly, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the microcontroller energy-efficient.

Bit Size: 32

A 32-bit microcontroller provides higher processing power and performance compared to lower bit sizes, making it suitable for complex tasks.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options offers flexibility in designing and integrating the microcontroller into different systems.

No. of Terminals: 100

Having a high number of terminals allows for connecting a wide range of external devices and peripherals, increasing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style offers easy integration onto printed circuit boards and efficient heat dissipation, ensuring optimal performance.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the microcontroller suitable for industrial applications where temperature variations are common.

RAM Bytes: 65536

A large RAM capacity enables the microcontroller to handle data-intensive tasks and multitasking operations efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high-speed processing and efficient performance, making it ideal for real-time applications.

Technical Specifications

Microcontrollers LM3S2918-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2918-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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