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LM3S2911-EQC50-A2T

Texas Instruments

LM3S2911-EQC50-A2T by Texas Instruments

LM3S2911-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 8.192 MHz, it is ideal for industrial applications requiring a wide temperature range from -40 to 105°C. With PWM channels and ADC capabilities, this microcontroller offers versatile control options in a compact flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,739 parts In-Stock

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Digiode

USA . 678 parts In-Stock

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678

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Distributors (Availability)

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AZTECH Wire

Italy . 848 parts In-Stock

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$11.976

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848

$11.976

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One Stop Electronics

USA . 674 parts In-Stock

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$25.000

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674

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Parana Technologies

USA . 806 parts In-Stock

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$76.393

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$7,094.263

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$68.754

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806

$76.393

$7,094.263

$68.754

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DigiPath Technology Company

USA . 364 parts In-Stock

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$84.118

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364

$84.118

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ChromeModa Solutions

Germany . 6,591 parts In-Stock

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$85.835

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$70.385

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6,591

$85.835

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

1+ parts

$85.835

100+ parts

$81.543

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$77.252

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1,951

$85.835

$81.543

$77.252

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Corphita

USA . 4,691 parts In-Stock

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Microchip USA

USA . 346 parts In-Stock

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Overview

Discover the innovative LM3S2911-EQC50-A2T microcontroller by Texas Instruments, setting new standards in efficiency and performance. This cutting-edge device boasts a 32-bit architecture, offering unmatched power and versatility for a wide range of applications. With its high-quality design and reliable performance, this microcontroller is perfect for industrial projects, IoT devices, and robotics. Experience seamless operation and superior functionality with the LM3S2911-EQC50-A2T, delivering value and benefits that exceed expectations. Upgrade your projects today with Texas Instruments' top-of-the-line microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 2.75 V

Lower supply voltage helps in reducing power consumption and heat generation.

Bit Size: 32

Higher bit size allows for more complex calculations and operations to be performed efficiently.

Power Supplies (V): 2.5,3.3

Compatibility with multiple power supply voltages offers flexibility in system design and integration.

No. of Terminals: 100

Sufficient number of terminals for interfacing with external components and peripherals.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes it suitable for use in harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels enable analog sensor interfacing and data acquisition.

ROM Words: 262144

Large ROM capacity for storing program instructions and data.

Maximum Clock Frequency: 8.192 MHz

High clock frequency allows for fast operation and response times.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers improved performance and efficiency for embedded applications.

RAM Bytes: 65536

Sufficient RAM capacity for data storage and manipulation during program execution.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications that require robust performance in challenging environments.

PWM Channels: YES

Integrated PWM channels for precise control of motors and other analog devices.

ROM Programmability: FLASH

Flash-based ROM allows for easy reprogramming of the microcontroller firmware.

Speed: 50 rpm

The speed specification may need to be clarified to provide a better understanding.

No. of I/O Lines: 60

Sufficient number of I/O lines for connecting to external peripherals and devices.

Technical Specifications

Microcontrollers LM3S2911-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2911-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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