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LM3S2793-IQC80-C5T

Texas Instruments

LM3S2793-IQC80-C5T by Texas Instruments

Texas Instruments LM3S2793-IQC80-C5T is a 32-bit Cortex-M3 microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and ADC/DMA capabilities. With a compact flatpack package style, it offers 67 I/O lines and PWM channels for versatile connectivity options.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,703 parts In-Stock

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Digiode

USA . 645 parts In-Stock

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645

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One Stop Electronics

USA . 1,431 parts In-Stock

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$5.000

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$5.000

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AZTECH Wire

Italy . 609 parts In-Stock

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$15.981

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609

$15.981

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Parana Technologies

USA . 1,621 parts In-Stock

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$32.115

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$98.460

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1,621

$32.115

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$98.460

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DigiPath Technology Company

USA . 959 parts In-Stock

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$35.362

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$32.533

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959

$35.362

$32.533

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ChromeModa Solutions

Germany . 4,012 parts In-Stock

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$36.084

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$29.589

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4,012

$36.084

$29.589

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IDEA Electronic Components Group

UK . 592 parts In-Stock

1+ parts

$36.084

100+ parts

$34.280

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$32.476

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592

$36.084

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$32.476

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Corphita

USA . 2,744 parts In-Stock

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Microchip USA

USA . 198 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S2793-IQC80-C5T microcontroller from Texas Instruments. Designed with cutting-edge technology and precision engineering, this versatile device is perfect for a wide range of applications. Whether you're working on IoT projects, industrial automation, or consumer electronics, this microcontroller delivers unmatched performance and reliability. Experience seamless integration and superior functionality, backed by Texas Instruments' reputation for excellence. Elevate your projects to new heights with the LM3S2793-IQC80-C5T microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the microcontroller.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 1.32 V

Can operate efficiently within a specific voltage range, ensuring stable performance.

Bit Size: 32

Offers high processing power and capability for complex tasks.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options for flexibility in various applications.

Package Style (Meter): FLATPACK

Compact package style for space-constrained designs.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures suitable for industrial environments.

CPU Family: CORTEX-M3

Uses a popular CPU architecture known for efficiency and performance.

Minimum Operating Temperature: -40 °C

Operates reliably in low-temperature conditions.

ADC Channels: YES

Analog-to-digital conversion capability for interfacing with analog sensors or signals.

RAM Bytes: 65536

Sufficient memory for data storage and processing tasks in a microcontroller.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimized performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Microcontrollers LM3S2793-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2793-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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