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LM3S2793-IQC80-C5

Texas Instruments

LM3S2793-IQC80-C5 by Texas Instruments

LM3S2793-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With features like ADC and DMA channels, this microcontroller is ideal for tasks that demand precise analog-to-digital conversion and efficient data transfer.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,644 parts In-Stock

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Chip Stock

USA . 2,900 parts In-Stock

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2,900

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Digiode

USA . 2,872 parts In-Stock

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2,872

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Distributors (Availability)

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AZTECH Wire

Italy . 674 parts In-Stock

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$18.621

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674

$18.621

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One Stop Electronics

USA . 248 parts In-Stock

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$31.000

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248

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Parana Technologies

USA . 1,353 parts In-Stock

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$45.525

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$45.525

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ChromeModa Solutions

Germany . 2,529 parts In-Stock

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$51.152

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$41.945

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$51.152

$41.945

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IDEA Electronic Components Group

UK . 2,349 parts In-Stock

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$51.152

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$48.594

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$46.037

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2,349

$51.152

$48.594

$46.037

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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Lixinc

USA . 6,914 parts In-Stock

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Corphita

USA . 3,113 parts In-Stock

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Futuretech Components

Singapore . 2,660 parts In-Stock

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DigiPath Technology Company

USA . 2,269 parts In-Stock

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$46.119

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Kepictronics

USA . 1,083 parts In-Stock

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A-Z Elektronik GmbH

Germany . 405 parts In-Stock

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Microchip USA

USA . 355 parts In-Stock

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Overview

Enhance your projects with the high-quality LM3S2793-IQC80-C5 microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and innovative solutions for various applications. This powerful 32-bit microcontroller boasts advanced features like ADC and DMA channels, as well as PWM capabilities, providing unmatched performance and flexibility. With its compact design and industrial-grade temperature range, this microcontroller is ideal for a wide range of projects. Experience the value and benefits of Texas Instruments' LM3S2793-IQC80-C5 in your next project today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

Allows for safe operation within specified voltage limits, preventing damage to the microcontroller.

Bit Size: 32

Offers high processing capabilities for complex tasks and calculations.

Power Supplies (V): 1.2,3.3

Provides options for different power supply voltages, allowing flexibility in system design.

No. of Terminals: 100

Offers a sufficient number of connections for interfacing with external components and peripherals.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures, suitable for a wide range of applications.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

ROM Words: 131072

Provides ample memory for storing program instructions and data.

Maximum Clock Frequency: 0.032 MHz

Supports high-speed processing for efficient operation.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimized performance.

RAM Bytes: 65536

Offers sufficient memory for data storage and manipulation during operation.

Technical Specifications

Microcontrollers LM3S2793-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2793-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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