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LM3S2793-IQC80-C3T

Texas Instruments

LM3S2793-IQC80-C3T by Texas Instruments

Texas Instruments LM3S2793-IQC80-C3T is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it offers 67 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,015 parts In-Stock

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Digiode

USA . 2,763 parts In-Stock

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2,763

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Distributors (Availability)

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AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$5.817

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641

$5.817

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Parana Technologies

USA . 774 parts In-Stock

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$13.338

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$13.851

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774

$13.338

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$13.851

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DigiPath Technology Company

USA . 360 parts In-Stock

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$14.687

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$13.512

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360

$14.687

$13.512

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ChromeModa Solutions

Germany . 1,506 parts In-Stock

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$14.987

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$12.289

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1,506

$14.987

$12.289

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IDEA Electronic Components Group

UK . 1,024 parts In-Stock

1+ parts

$14.987

100+ parts

$14.238

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$13.488

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1,024

$14.987

$14.238

$13.488

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One Stop Electronics

USA . 980 parts In-Stock

1+ parts

$16.000

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980

$16.000

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Corphita

USA . 2,813 parts In-Stock

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Microchip USA

USA . 247 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments LM3S2793-IQC80-C3T microcontroller. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. Whether you're working on robotics, IoT devices, or industrial automation, this microcontroller delivers the speed, versatility, and efficiency you need to bring your projects to life. Trust in Texas Instruments' legacy of excellence and revolutionize the way you create with the LM3S2793-IQC80-C3T.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making the product suitable for mass production.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protects the device from overvoltage damage.

Package Shape: SQUARE

The square package shape provides compactness and efficient use of space on the PCB.

Bit Size: 32

The 32-bit architecture enables higher computational capabilities and processing power for advanced applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexibility in designing applications requiring different voltage levels.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with various external components and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and easy installation, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product is suitable for industrial applications that may require operation in high-temperature environments.

Minimum Operating Temperature: -40 °C

The product can operate reliably in cold environments with a minimum operating temperature of -40°C.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and conversion, enhancing the product's versatility in interfacing with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position facilitates easier PCB layout and connection to peripheral devices.

ROM Words: 131072

The large ROM size of 131072 words allows for storing a significant amount of program data and code for complex applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm enables a slim and compact form factor for space-efficient designs.

Width: 14 mm

The width of 14 mm provides a balanced footprint for easy integration into various PCB layouts.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz allows for fast and efficient execution of instructions, improving overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds during assembly processes, ensuring reliable solder connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can endure the high temperatures of the reflow soldering process without damage.

Length: 14 mm

The length of 14 mm contributes to the overall compactness and space-saving design of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates essential peripherals on a single chip, simplifying system design and reducing component count.

RAM Bytes: 65536

The large RAM size of 65536 bytes provides ample memory for data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form ensures secure solder connections and reliable electrical contact during PCB assembly.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides a stable operating voltage for powering the device and its peripherals.

PWM Channels: YES

Support for PWM channels enables precise control of analog outputs, making the product suitable for tasks like motor control and LED dimming.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and rapid reprogramming of the memory, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting on the PCB and minimizes PCB space requirements.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product can withstand a higher number of reflow cycles during assembly without compromising performance or reliability.

Speed: 80 rpm

The speed rating of 80 rpm indicates the product's capability to perform tasks at a fast pace, suitable for time-critical applications.

No. of I/O Lines: 67

The product offers 67 I/O lines for interfacing with external devices and sensors, enabling versatile connectivity options and system integration.

Technical Specifications

Microcontrollers LM3S2793-IQC80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2793-IQC80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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