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LM3S2793-IQC80-C3

Texas Instruments

LM3S2793-IQC80-C3 by Texas Instruments

LM3S2793-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it features 67 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,037 parts In-Stock

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6,037

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Digiode

USA . 368 parts In-Stock

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368

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Distributors (Availability)

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One Stop Electronics

USA . 564 parts In-Stock

1+ parts

$1.000

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564

$1.000

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AZTECH Wire

Italy . 357 parts In-Stock

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$9.286

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357

$9.286

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Parana Technologies

USA . 1,920 parts In-Stock

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$14.232

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$14.683

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$14.232

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$14.683

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DigiPath Technology Company

USA . 86 parts In-Stock

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$15.671

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$14.417

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86

$15.671

$14.417

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ChromeModa Solutions

Germany . 4,335 parts In-Stock

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$15.991

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$13.113

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4,335

$15.991

$13.113

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IDEA Electronic Components Group

UK . 1,719 parts In-Stock

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$15.991

100+ parts

$15.191

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$14.392

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1,719

$15.991

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$14.392

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Lixinc

USA . 15,130 parts In-Stock

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Corphita

USA . 3,195 parts In-Stock

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Microchip USA

USA . 239 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S2793-IQC80-C3 microcontroller by Texas Instruments. This cutting-edge device offers unmatched quality and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional performance and efficiency. Experience seamless integration and innovative features that will take your projects to the next level. Elevate your designs with the LM3S2793-IQC80-C3 and unleash your creativity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy assembly and compact design, making this microcontroller suitable for small and densely populated PCBs.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this microcontroller can operate efficiently in low power applications.

Package Shape: SQUARE

Square package shape provides ease of handling and mounting on the PCB, ensuring a compact design.

Bit Size: 32

32-bit architecture allows for high processing capability, making this microcontroller suitable for complex tasks and applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supplies (1.2V and 3.3V) offers flexibility in designing circuits with different voltage requirements.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style enables easy integration into existing PCB designs and facilitates efficient heat dissipation.

Minimum Supply Voltage: 2.25 V

Ability to operate at low supply voltages (2.25V) enhances energy efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature (85°C) allows this microcontroller to be used in industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40°C to 85°C) ensures reliable operation in harsh environmental conditions, making it suitable for outdoor and automotive applications.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, providing accurate sensor interfacing capabilities in data acquisition systems.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and ensures reliable connectivity during assembly, enhancing the overall product reliability.

ROM Words: 131072

Large ROM capacity (131072 words) allows for storing complex program codes and data, making this microcontroller suitable for advanced applications.

Maximum Seated Height: 1.6 mm

Low seated height (1.6 mm) enables a slim design profile, making it suitable for space-constrained applications.

Width: 14 mm

Compact width (14 mm) allows for tight PCB layouts and efficient space utilization in electronic designs.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency (0.032 MHz) enables fast processing speed and efficient execution of instructions in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this microcontroller is suitable for automated assembly processes with quick soldering cycles.

Peak Reflow Temperature °C: 260

High peak reflow temperature (260°C) ensures robust solder joints during the assembly process, improving the overall reliability of the product.

Length: 14 mm

Compact length (14 mm) contributes to a small form factor, making this microcontroller ideal for applications where size constraints are critical.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions, making it suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals, this product simplifies system design and reduces component count, saving board space and cost.

RAM Bytes: 65536

Generous RAM capacity (65536 bytes) allows for efficient data storage and processing, enabling the microcontroller to handle complex computations and multitasking.

Technology: CMOS

Using CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making this microcontroller suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical support and facilitates easy soldering during the assembly process, ensuring reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage (2.5V) ensures consistent performance and compatibility with standard power sources, simplifying system integration.

PWM Channels: YES

Built-in PWM channels enable precise control of motor speeds, LED brightness, and other analog signal modulation, expanding the range of applications for this microcontroller.

ROM Programmability: FLASH

Flash ROM programmability allows for reprogramming the microcontroller multiple times, facilitating firmware updates and customization without requiring external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch (0.5 mm) offers high-density PCB layouts and facilitates miniaturization, making this microcontroller suitable for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good resistance to moisture absorption, ensuring reliability during soldering and handling processes, especially in humid environments.

Speed: 80 rpm

Having a speed of 80 revolutions per minute (rpm) can be an applicable spec for motor control applications or encoders, enabling precise and efficient speed control.

No. of I/O Lines: 67

Abundance of I/O lines (67) allows for extensive interfacing with external devices, sensors, and peripherals, making this microcontroller versatile and suitable for diverse applications.

Technical Specifications

Microcontrollers LM3S2793-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2793-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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