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LM3S2793-IQC80-C1

Texas Instruments

LM3S2793-IQC80-C1 by Texas Instruments

LM3S2793-IQC80-C1 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and DMA channels, as well as PWM functionality. The package style is flatpack with a terminal pitch of 0.5 mm, making it compact and versatile for various electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,814 parts In-Stock

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Vyrian

USA . 4,126 parts In-Stock

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4,126

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Distributors (Availability)

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One Stop Electronics

USA . 487 parts In-Stock

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$6.000

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487

$6.000

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AZTECH Wire

Italy . 510 parts In-Stock

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$15.045

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510

$15.045

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Parana Technologies

USA . 328 parts In-Stock

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$42.720

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328

$42.720

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DigiPath Technology Company

USA . 2,065 parts In-Stock

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$47.040

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2,065

$47.040

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ChromeModa Solutions

Germany . 6,265 parts In-Stock

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$48.000

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$39.360

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6,265

$48.000

$39.360

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IDEA Electronic Components Group

UK . 1,504 parts In-Stock

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$48.000

100+ parts

$45.600

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$43.200

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1,504

$48.000

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$43.200

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Corphita

USA . 4,940 parts In-Stock

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Microchip USA

USA . 219 parts In-Stock

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Overview

Experience the next level of innovation with the LM3S2793-IQC80-C1 microcontroller by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, offering unparalleled performance and efficiency. With advanced features like ADC and DMA channels, PWM capability, and ample RAM and ROM, this product provides exceptional value and benefits to customers looking for top-of-the-line performance in a compact package. Embrace the future of technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications where weight and durability are important factors.

Surface Mount: YES

Surface mount technology allows for compact, efficient designs and easier assembly processes.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Bit Size: 32

The 32-bit architecture provides higher processing power and efficiency compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 1.2,3.3

Having multiple power supply options allows for compatibility with a variety of systems and voltage requirements.

No. of Terminals: 100

With a high number of terminals, this microcontroller can support a wide range of input and output connections for versatile functionality.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this microcontroller suitable for use in harsh environments or extreme conditions.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors or inputs, expanding its range of applications.

ROM Words: 131072

The large ROM capacity allows for storing complex programs and data, making the microcontroller suitable for demanding applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller offers robust performance and reliability under challenging conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and interfaces on a single chip, simplifying system design and reducing component count.

RAM Bytes: 65536

The generous amount of RAM allows for efficient data processing and storage, enhancing the microcontroller's performance in multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals, making the microcontroller suitable for applications requiring accurate timing and control.

Technical Specifications

Microcontrollers LM3S2793-IQC80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2793-IQC80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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