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LM3S2739-EQC50-A2T

Texas Instruments

LM3S2739-EQC50-A2T by Texas Instruments

Texas Instruments' LM3S2739-EQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating in industrial temperatures from -40 to 105 °C, it features 56 I/O lines, PWM channels, and ADC channels for various applications like embedded systems and IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,532 parts In-Stock

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5,532

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Digiode

USA . 3,497 parts In-Stock

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3,497

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 573 parts In-Stock

1+ parts

$11.000

100+ parts

-

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573

$11.000

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AZTECH Wire

Italy . 824 parts In-Stock

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$19.440

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824

$19.440

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Parana Technologies

USA . 368 parts In-Stock

1+ parts

$33.403

100+ parts

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$124.853

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368

$33.403

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$124.853

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DigiPath Technology Company

USA . 680 parts In-Stock

1+ parts

$36.780

100+ parts

$33.838

1k+ parts

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680

$36.780

$33.838

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ChromeModa Solutions

Germany . 6,551 parts In-Stock

1+ parts

$37.531

100+ parts

$30.775

1k+ parts

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6,551

$37.531

$30.775

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IDEA Electronic Components Group

UK . 397 parts In-Stock

1+ parts

$37.531

100+ parts

$35.654

1k+ parts

$33.778

10k+ parts

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397

$37.531

$35.654

$33.778

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Corphita

USA . 1,274 parts In-Stock

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1,274

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Microchip USA

USA . 252 parts In-Stock

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252

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Overview

Unlock endless possibilities with the LM3S2739-EQC50-A2T by Texas Instruments! As a leader in microcontroller technology, Texas Instruments ensures top-notch quality and reliability. This powerful 32-bit microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. From its high-speed performance to its versatile capabilities, the LM3S2739-EQC50-A2T delivers superior functionality that will take your projects to the next level. Upgrade your designs today with this exceptional product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easier and more efficient PCB assembly process.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications.

Package Shape: SQUARE

Space-efficient design for compact devices.

Bit Size: 32

High processing capability and efficiency.

Power Supplies (V): 2.5,3.3

Versatile power options for different system requirements.

No. of Terminals: 100

Sufficient connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK

Easy integration into various electronic systems.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even at lower voltages.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for different environments.

Terminal Finish: TIN

Provides reliable connections and corrosion resistance.

ADC Channels: YES

Ability to convert analog signals to digital for enhanced functionality.

Terminal Position: QUAD

Efficient layout for better signal routing.

ROM Words: 131072

Sufficient memory capacity for storing program and data.

Maximum Seated Height: 1.6 mm

Low profile design for slim devices.

Width: 14 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High-speed processing capabilities.

Length: 14 mm

Square shape design for balanced dimensions.

Temperature Grade: INDUSTRIAL

Designed to operate in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for improved performance.

RAM Bytes: 65536

Sufficient random access memory for data processing.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Terminal Form: GULL WING

Easy soldering and handling during assembly.

Nominal Supply Voltage: 2.5 V

Optimal voltage level for stable operation.

PWM Channels: YES

Support for pulse-width modulation for precise control.

ROM Programmability: FLASH

Quick and easy reprogramming of memory contents.

Terminal Pitch: 0.5 mm

Fine pitch for compact PCB design.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes.

Speed: 50 rpm

High-speed operation for real-time applications.

No. of I/O Lines: 56

Sufficient input/output options for connecting external devices.

Technical Specifications

Microcontrollers LM3S2739-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2739-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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