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LM3S2730-IQC50-A2T

Texas Instruments

LM3S2730-IQC50-A2T by Texas Instruments

Texas Instruments LM3S2730-IQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 60 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,912 parts In-Stock

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Digiode

USA . 2,226 parts In-Stock

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2,226

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Distributors (Availability)

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One Stop Electronics

USA . 1,076 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,076

$8.000

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$13.543

100+ parts

$12.324

1k+ parts

$11.105

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500

$13.543

$12.324

$11.105

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AZTECH Wire

Italy . 270 parts In-Stock

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$17.261

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270

$17.261

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Microchip USA

USA . 2,734 parts In-Stock

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$39.730

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$39.160

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$38.870

10k+ parts

$38.590

2,734

$39.730

$39.160

$38.870

$38.590

Parana Technologies

USA . 1,263 parts In-Stock

1+ parts

$41.816

100+ parts

$3,883.228

1k+ parts

$37.634

10k+ parts

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1,263

$41.816

$3,883.228

$37.634

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DigiPath Technology Company

USA . 1,629 parts In-Stock

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$46.044

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1,629

$46.044

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ChromeModa Solutions

Germany . 4,583 parts In-Stock

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$46.984

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$38.527

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4,583

$46.984

$38.527

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IDEA Electronic Components Group

UK . 1,231 parts In-Stock

1+ parts

$46.984

100+ parts

$44.635

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$42.286

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1,231

$46.984

$44.635

$42.286

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Component Stockers USA

USA . 538 parts In-Stock

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$99.990

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538

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Corphita

USA . 2,794 parts In-Stock

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2,794

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Overview

Experience the power of innovation with the LM3S2730-IQC50-A2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in every product they manufacture. This microcontroller opens up a world of possibilities in various applications, providing customers with unmatched performance and efficiency. With cutting-edge technology and a wide range of features, the LM3S2730-IQC50-A2T delivers exceptional value and benefits to all users, making it the perfect choice for your next project. Unlock your potential with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage helps in minimizing power consumption and heat dissipation.

Bit Size: 32

32-bit architecture provides high processing power and efficiency for complex computational tasks.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages offers flexibility in different operating conditions and power efficiency.

No. of Terminals: 100

Ample number of terminals allow for versatile connectivity options and integration with external devices.

Package Style (Meter): FLATPACK

Flatpack design enables easy assembly and soldering processes, enhancing manufacturing efficiency.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme environmental conditions, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, optimizing overall performance and reliability.

RAM Bytes: 65536

Large RAM capacity enables efficient data processing and multitasking capabilities, enhancing overall system performance.

Technical Specifications

Microcontrollers LM3S2730-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2730-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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