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LM3S2730-IBZ50-A2T

Texas Instruments

LM3S2730-IBZ50-A2T by Texas Instruments

LM3S2730-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With 60 I/O lines and PWM channels, this microcontroller offers versatile connectivity options for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,652 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,652

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Digiode

USA . 1,716 parts In-Stock

1+ parts

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100+ parts

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1,716

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 609 parts In-Stock

1+ parts

$6.888

100+ parts

-

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609

$6.888

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Parana Technologies

USA . 762 parts In-Stock

1+ parts

$16.110

100+ parts

-

1k+ parts

$16.438

10k+ parts

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762

$16.110

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$16.438

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DigiPath Technology Company

USA . 647 parts In-Stock

1+ parts

$17.739

100+ parts

$16.320

1k+ parts

-

10k+ parts

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647

$17.739

$16.320

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ChromeModa Solutions

Germany . 6,706 parts In-Stock

1+ parts

$18.101

100+ parts

$14.843

1k+ parts

-

10k+ parts

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6,706

$18.101

$14.843

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IDEA Electronic Components Group

UK . 171 parts In-Stock

1+ parts

$18.101

100+ parts

$17.196

1k+ parts

$16.291

10k+ parts

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171

$18.101

$17.196

$16.291

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One Stop Electronics

USA . 968 parts In-Stock

1+ parts

$26.000

100+ parts

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968

$26.000

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Microchip USA

USA . 2,492 parts In-Stock

1+ parts

$39.730

100+ parts

$39.160

1k+ parts

$38.870

10k+ parts

$38.590

2,492

$39.730

$39.160

$38.870

$38.590

Corphita

USA . 3,250 parts In-Stock

1+ parts

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3,250

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Overview

Elevate your electronic designs with the Texas Instruments LM3S2730-IBZ50-A2T microcontroller. Crafted with precision and expertise by a renowned manufacturer, this powerful device offers unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller delivers exceptional value, efficiency, and innovation. Say goodbye to limitations and hello to endless possibilities with the LM3S2730-IBZ50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75V ensures safe voltage levels for the microcontroller, preventing damage from overvoltage.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, maximizing component density.

Bit Size: 32

32-bit architecture provides high processing power and performance for handling complex tasks and calculations efficiently.

Power Supplies (V): 2.5,3.3

Multiple power supply options of 2.5V and 3.3V offer flexibility in voltage selection based on specific application requirements.

No. of Terminals: 108

With 108 terminals, this microcontroller offers a wide range of connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY

Grid array package style provides reliable connections and mechanical strength, ensuring secure mounting on the PCB.

Minimum Supply Voltage: 2.25 V

With a minimum supply voltage of 2.25V, the microcontroller can operate effectively even at lower voltage levels.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the microcontroller to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures that the microcontroller can operate in cold environments without issues.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin-Silver-Copper provides good conductivity and corrosion resistance, enhancing the durability of the microcontroller.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to convert analog signals into digital data, expanding its versatility in data acquisition applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering during installation, enhancing the reliability of the connections.

ROM Words: 131072

With 131072 ROM words, the microcontroller offers ample memory capacity for storing program data and instructions.

Maximum Seated Height: 1.5 mm

Low maximum seated height of 1.5mm allows for compact design and integration into space-constrained applications.

Width: 10 mm

Compact width of 10mm ensures efficient use of board space and enables the microcontroller to be used in small form factor devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32MHz enables fast data processing and high-speed operation for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microcontroller can withstand reflow soldering processes effectively.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable solder joints and component connections during manufacturing processes.

Length: 10 mm

Compact length of 10mm allows for efficient placement on the PCB and contributes to overall space-saving design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the microcontroller can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture delivers high performance, low power consumption, and streamlined instruction execution for efficient operation.

RAM Bytes: 65536

With 65536 bytes of RAM, the microcontroller provides sufficient memory for data storage and processing, enhancing multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and efficient heat dissipation, ensuring optimal performance and durability of the microcontroller.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable operation of the microcontroller under normal operating conditions.

PWM Channels: YES

Presence of PWM channels allows the microcontroller to generate precise and adjustable pulse-width modulation signals, suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash programmability of ROM enables easy and flexible reprogramming of the microcontroller's memory contents, facilitating firmware updates and customization.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm enables compact and high-density PCB layouts, saving space and enhancing the overall design efficiency.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 50 rpm

Operating at a speed of 50 rotations per minute (RPM) ensures efficient data processing and execution of tasks, suitable for various real-time applications.

No. of I/O Lines: 60

With 60 I/O lines, the microcontroller offers ample input and output capabilities for interfacing with external devices and peripherals, enhancing system connectivity and functionality.

Technical Specifications

Microcontrollers LM3S2730-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2730-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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