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LM3S2730-EQC50-A2

Texas Instruments

LM3S2730-EQC50-A2 by Texas Instruments

LM3S2730-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a temperature range from -40 to 105 °C, it offers versatile performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,337 parts In-Stock

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6,337

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Digiode

USA . 2,351 parts In-Stock

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2,351

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Distributors (Availability)

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One Stop Electronics

USA . 907 parts In-Stock

1+ parts

$3.000

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-

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907

$3.000

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AZTECH Wire

Italy . 399 parts In-Stock

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$7.524

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399

$7.524

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Parana Technologies

USA . 609 parts In-Stock

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$19.490

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$19.496

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609

$19.490

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$19.496

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DigiPath Technology Company

USA . 1,034 parts In-Stock

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$21.461

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1,034

$21.461

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IDEA Electronic Components Group

UK . 1,003 parts In-Stock

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$21.899

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$20.804

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$19.709

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1,003

$21.899

$20.804

$19.709

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ChromeModa Solutions

Germany . 132 parts In-Stock

1+ parts

$21.899

100+ parts

$17.957

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132

$21.899

$17.957

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QUARKTWIN TECHNOLOGY LTD

USA . 2,661 parts In-Stock

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Corphita

USA . 2,393 parts In-Stock

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Microchip USA

USA . 107 parts In-Stock

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Overview

Elevate your projects with the LM3S2730-EQC50-A2 microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled quality and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional performance and efficiency. Experience seamless integration and superior functionality with Texas Instruments' cutting-edge technology. Upgrade your designs and unlock endless possibilities with the LM3S2730-EQC50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on PCBs.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, ensuring stable performance.

Bit Size: 32

With a higher bit size, this microcontroller can handle more complex operations and calculations.

Power Supplies (V): 2.5, 3.3

Offers flexibility in power supply options, making it compatible with various systems.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components or peripherals.

Package Style (Meter): FLATPACK

The flatpack design allows for a compact and space-saving layout on the PCB.

Maximum Operating Temperature: 105 °C

Capable of operating in high-temperature environments, ideal for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses a RISC architecture for efficient and streamlined processing of instructions.

RAM Bytes: 65536

Offers a large memory capacity for data storage and program execution.

Technical Specifications

Microcontrollers LM3S2730-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2730-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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