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LM3S2651-IBZ50-A2T

Texas Instruments

LM3S2651-IBZ50-A2T by Texas Instruments

LM3S2651-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring up to 53 I/O lines and PWM channels. With a temperature range of -40 to 85 °C, it offers versatile performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,981 parts In-Stock

1+ parts

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8,981

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Digiode

USA . 4,325 parts In-Stock

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4,325

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 547 parts In-Stock

1+ parts

$5.000

100+ parts

-

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547

$5.000

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AZTECH Wire

Italy . 841 parts In-Stock

1+ parts

$19.407

100+ parts

-

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841

$19.407

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Parana Technologies

USA . 935 parts In-Stock

1+ parts

$45.567

100+ parts

$4,231.597

1k+ parts

$41.010

10k+ parts

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935

$45.567

$4,231.597

$41.010

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DigiPath Technology Company

USA . 658 parts In-Stock

1+ parts

$50.175

100+ parts

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658

$50.175

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ChromeModa Solutions

Germany . 6,076 parts In-Stock

1+ parts

$51.199

100+ parts

$41.983

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6,076

$51.199

$41.983

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IDEA Electronic Components Group

UK . 20 parts In-Stock

1+ parts

$51.199

100+ parts

$48.639

1k+ parts

$46.079

10k+ parts

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20

$51.199

$48.639

$46.079

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Microchip USA

USA . 3,267 parts In-Stock

1+ parts

$56.120

100+ parts

$55.150

1k+ parts

$54.660

10k+ parts

$54.170

3,267

$56.120

$55.150

$54.660

$54.170

Corphita

USA . 512 parts In-Stock

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512

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Overview

Elevate your projects with the LM3S2651-IBZ50-A2T microcontroller by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. Whether you're designing innovative electronics or creating cutting-edge IoT devices, this product delivers exceptional value with its advanced features and functionality. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy PCB assembly and compact design.

Maximum Supply Voltage: 2.75 V

Allows for safe operation within a specific voltage range.

Bit Size: 32

Offers high computational capabilities and processing power.

Power Supplies (V): 2.5,3.3

Provides flexibility in power options for different applications.

No. of Terminals: 108

Provides ample connectivity options for interfacing with external components.

Package Style (Meter): GRID ARRAY

Enhances thermal management and efficiency in dissipating heat.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Allows for operation in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Ensures reliable performance in extreme cold temperatures.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and reliable electrical connections.

ADC Channels: YES

Enables accurate analog-to-digital conversion for sensor interfacing.

Terminal Position: BOTTOM

Facilitates easy soldering and PCB mounting.

ROM Words: 131072

Offers ample memory storage for program and data storage.

Maximum Seated Height: 1.5 mm

Allows for compact and slim device design.

Width: 10 mm

Provides a balance between size and performance.

Maximum Clock Frequency: 0.032 MHz

Ensures high-speed operation for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes.

Length: 10 mm

Provides a compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with robust temperature requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Incorporates a RISC architecture for efficient data processing.

RAM Bytes: 32768

Offers ample random access memory for program execution and data storage.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Facilitates reliable solder connections and robust mechanical support.

Nominal Supply Voltage: 2.5 V

Standard operating voltage for compatibility with various power sources.

PWM Channels: YES

Provides pulse-width modulation capabilities for precise control of connected devices.

ROM Programmability: FLASH

Enables flexible and fast reprogramming of the read-only memory.

Terminal Pitch: 0.8 mm

Offers standard spacing for easy PCB layout and assembly.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture during storage and handling.

Speed: 50 rpm

Provides a high processing speed for time-sensitive applications.

No. of I/O Lines: 53

Offers a sufficient number of input/output lines for device connectivity.

Technical Specifications

Microcontrollers LM3S2651-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2651-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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