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LM3S2651-IBZ50-A2

Texas Instruments

LM3S2651-IBZ50-A2 by Texas Instruments

LM3S2651-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,382 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,382

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Vyrian

USA . 1,940 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,940

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 504 parts In-Stock

1+ parts

$14.000

100+ parts

-

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10k+ parts

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504

$14.000

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-

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AZTECH Wire

Italy . 210 parts In-Stock

1+ parts

$19.418

100+ parts

-

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210

$19.418

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Parana Technologies

USA . 650 parts In-Stock

1+ parts

$45.399

100+ parts

-

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650

$45.399

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DigiPath Technology Company

USA . 1,402 parts In-Stock

1+ parts

$49.990

100+ parts

-

1k+ parts

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10k+ parts

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1,402

$49.990

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-

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ChromeModa Solutions

Germany . 4,172 parts In-Stock

1+ parts

$51.010

100+ parts

$41.828

1k+ parts

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10k+ parts

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4,172

$51.010

$41.828

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IDEA Electronic Components Group

UK . 1,575 parts In-Stock

1+ parts

$51.010

100+ parts

$48.460

1k+ parts

$45.909

10k+ parts

-

1,575

$51.010

$48.460

$45.909

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Microchip USA

USA . 1,120 parts In-Stock

1+ parts

$63.980

100+ parts

$62.870

1k+ parts

$62.310

10k+ parts

$61.760

1,120

$63.980

$62.870

$62.310

$61.760

Corphita

USA . 1,230 parts In-Stock

1+ parts

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1,230

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Overview

Unlock the power of cutting-edge technology with the LM3S2651-IBZ50-A2 microcontroller by Texas Instruments. Renowned for their superior quality and innovation, Texas Instruments delivers reliable solutions for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unparalleled performance and versatility. Experience seamless integration, efficient power management, and advanced features that will elevate your projects to new heights. Trust Texas Instruments to provide you with the tools you need to succeed in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, reducing the risk of damage or malfunction.

Package Shape: SQUARE

Facilitates uniform placement and alignment on the PCB, enhancing overall design aesthetics.

Bit Size: 32

Offers high processing capabilities and precision for complex tasks and calculations.

Power Supplies (V): 2.5,3.3

Provides flexibility in power options, allowing compatibility with various voltage sources.

No. of Terminals: 108

Offers ample connections for interfacing with external devices and peripherals, expanding functionality.

Package Style (Meter): GRID ARRAY

Ensures secure attachment to the PCB and efficient heat dissipation, enhancing reliability.

Minimum Supply Voltage: 2.25 V

Maintains stability during low voltage conditions, preventing fluctuations and potential damage.

Maximum Operating Temperature: 85 °C

Allows for operation in high-temperature environments without compromising performance or safety.

Minimum Operating Temperature: -40 °C

Ensures functionality in cold conditions, making the microcontroller suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Enables analog-to-digital conversion, making the microcontroller suitable for sensor interfacing and data acquisition.

Terminal Position: BOTTOM

Facilitates easy PCB layout and soldering, simplifying the manufacturing process.

ROM Words: 131072

Offers large memory capacity for storing program instructions and data, enabling complex applications.

Maximum Seated Height: 1.5 mm

Allows for compact and slim designs, ideal for applications with space constraints.

Width: 10 mm

Provides a small form factor, suitable for miniaturized electronic devices and IoT applications.

Maximum Clock Frequency: 0.032 MHz

Supports high-speed operation for quick data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly, reducing the risk of defects and ensuring product quality.

Peak Reflow Temperature °C: 260

Allows for reliable soldering without damaging the microcontroller, ensuring long-term durability.

Length: 10 mm

Contributes to the compact form factor, optimizing space utilization on the PCB.

Temperature Grade: INDUSTRIAL

Meets industrial standards for temperature range and reliability, suitable for rugged environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes efficient RISC architecture for high performance and low power consumption, ideal for battery-powered devices.

RAM Bytes: 32768

Provides sufficient memory for data storage and processing, enabling multitasking and complex algorithms.

Technology: CMOS

Features CMOS technology for low power consumption and high noise immunity, improving energy efficiency and reliability.

Terminal Form: BALL

Facilitates reliable connections and soldering during assembly, enhancing overall product quality.

Nominal Supply Voltage: 2.5 V

Defines the recommended operating voltage for optimal performance and stability.

PWM Channels: YES

Supports pulse-width modulation for precise control of connected devices, suitable for motor control and power regulation.

ROM Programmability: FLASH

Allows for easy programming and updating of firmware, enabling flexibility and customization.

Terminal Pitch: 0.8 mm

Defines the spacing between terminals for easy soldering and PCB layout, improving manufacturability.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture during storage and operation, ensuring reliability in humid environments.

Speed: 50 rpm

Specifies the speed of operation for real-time processing and response, suitable for time-sensitive applications.

No. of I/O Lines: 53

Provides ample input/output options for interfacing with peripherals and external devices, enhancing overall system functionality.

Technical Specifications

Microcontrollers LM3S2651-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2651-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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