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LM3S2637-IBZ50-A2T

Texas Instruments

LM3S2637-IBZ50-A2T by Texas Instruments

LM3S2637-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring up to 46 I/O lines and PWM channels. With a temperature range from -40 to 85 °C, it offers versatile performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,108 parts In-Stock

1+ parts

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4,108

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Digiode

USA . 3,915 parts In-Stock

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3,915

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Distributors (Availability)

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One Stop Electronics

USA . 813 parts In-Stock

1+ parts

$2.000

100+ parts

-

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813

$2.000

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AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$5.829

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680

$5.829

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Parana Technologies

USA . 1,150 parts In-Stock

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$38.292

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1,150

$38.292

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Microchip USA

USA . 3,114 parts In-Stock

1+ parts

$41.960

100+ parts

$41.360

1k+ parts

$41.060

10k+ parts

$40.760

3,114

$41.960

$41.360

$41.060

$40.760

DigiPath Technology Company

USA . 456 parts In-Stock

1+ parts

$42.164

100+ parts

$38.791

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456

$42.164

$38.791

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IDEA Electronic Components Group

UK . 1,966 parts In-Stock

1+ parts

$43.025

100+ parts

$40.874

1k+ parts

$38.722

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1,966

$43.025

$40.874

$38.722

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ChromeModa Solutions

Germany . 1,085 parts In-Stock

1+ parts

$43.025

100+ parts

$35.280

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1,085

$43.025

$35.280

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Corphita

USA . 1,344 parts In-Stock

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1,344

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Overview

Unleash the power of innovation with the LM3S2637-IBZ50-A2T by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality microcontrollers that exceed expectations. Designed for a wide range of applications, this product offers unparalleled value with its advanced features and reliable performance. Whether you are a seasoned professional or a hobbyist, this microcontroller opens up endless possibilities for your projects. Experience the difference with Texas Instruments and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology makes it easier to assemble the microcontroller onto PCBs, saving space and allowing for automated production.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V provides a safe operating range for the microcontroller, preventing damage from overvoltage.

Package Shape: SQUARE

The square package shape helps in efficient PCB layout and utilization of space, especially in compact electronic devices.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and tasks efficiently, suitable for high-performance applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5 V and 3.3 V) offers flexibility in designing circuits and interfacing with different components.

No. of Terminals: 108

Having 108 terminals allows for a wide range of input/output connections, enabling connectivity with various external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style simplifies the integration of the microcontroller into the overall system design, improving reliability and performance.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures stable operation of the microcontroller even under low power conditions, enhancing reliability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions without compromising performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and efficiency in processing instructions, making it suitable for real-time applications.

RAM Bytes: 32768

With a large RAM size of 32768 bytes, the microcontroller can efficiently handle data storage and manipulation requirements for complex applications.

Technical Specifications

Microcontrollers LM3S2637-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2637-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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