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LM3S2637-EQC50-A2T

Texas Instruments

LM3S2637-EQC50-A2T by Texas Instruments

LM3S2637-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 46 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 105 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,552 parts In-Stock

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Digiode

USA . 3,905 parts In-Stock

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3,905

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Distributors (Availability)

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AZTECH Wire

Italy . 852 parts In-Stock

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$18.053

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852

$18.053

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One Stop Electronics

USA . 920 parts In-Stock

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$31.000

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920

$31.000

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Parana Technologies

USA . 1,609 parts In-Stock

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$73.000

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$73.000

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DigiPath Technology Company

USA . 1,247 parts In-Stock

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$80.383

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1,247

$80.383

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ChromeModa Solutions

Germany . 4,690 parts In-Stock

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$82.023

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$67.259

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4,690

$82.023

$67.259

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IDEA Electronic Components Group

UK . 137 parts In-Stock

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$82.023

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$77.922

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$73.821

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137

$82.023

$77.922

$73.821

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Corphita

USA . 1,759 parts In-Stock

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Microchip USA

USA . 260 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S2637-EQC50-A2T microcontroller from Texas Instruments. Built with top-notch quality and reliability, this versatile device is perfect for a wide range of applications. Whether you're looking to enhance your industrial automation systems or develop cutting-edge consumer electronics, this microcontroller delivers unparalleled performance and efficiency. Say goodbye to limitations and hello to innovation with the LM3S2637-EQC50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection against environmental factors, ensuring the longevity of the microcontroller.

Surface Mount: YES

Allows for easy integration into PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, ensuring efficient operation.

Package Shape: SQUARE

Facilitates uniform and compact PCB layout, optimizing space utilization.

Bit Size: 32

Enables handling of complex operations and data processing efficiently.

Power Supplies (V): 2.5,3.3

Offers flexibility in power options, allowing compatibility with various systems.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK

Ensures easy installation and maintenance of the microcontroller in electronic devices.

Minimum Supply Voltage: 2.25 V

Operates efficiently even at low voltage levels, saving power.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Designed to withstand harsh environmental conditions, ensuring reliable performance.

Terminal Finish: TIN

Provides good electrical conductivity and solderability for reliable connections.

ADC Channels: YES

Allows for analog input signals to be converted into digital data, expanding the functionality of the microcontroller.

Terminal Position: QUAD

Facilitates easy PCB layout and ensures stable connections.

ROM Words: 131072

Provides ample storage for program and data, allowing for complex applications to be run.

Maximum Seated Height: 1.6 mm

Low profile design makes it suitable for compact electronic devices.

Width: 14 mm

Compact size enables integration into space-constrained PCBs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for fast data processing and operation.

Length: 14 mm

Compact form factor for easy integration.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing and control capabilities.

RAM Bytes: 32768

Sufficient memory for data storage and processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals offer reliable electrical connections and ease of soldering.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Allows for precise control of connected components through pulse-width modulation.

ROM Programmability: FLASH

Flash ROM enables easy reprogramming of the microcontroller for firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch terminals for compact PCB design.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure.

Speed: 50 rpm

Capable of high-speed data processing and control operations.

No. of I/O Lines: 46

Sufficient input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2637-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2637-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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