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LM3S2637-EQC50-A2

Texas Instruments

LM3S2637-EQC50-A2 by Texas Instruments

LM3S2637-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates in industrial temperatures (-40 to 105 °C) and has 46 I/O lines, making it ideal for applications requiring high-speed processing and multiple input/output functionalities. With a max clock frequency of 0.032 MHz, this microcontroller is suitable for various embedded systems projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,122 parts In-Stock

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4,122

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Digiode

USA . 175 parts In-Stock

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175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$16.621

100+ parts

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888

$16.621

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Parana Technologies

USA . 2,358 parts In-Stock

1+ parts

$26.507

100+ parts

-

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$27.087

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2,358

$26.507

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$27.087

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DigiPath Technology Company

USA . 2,120 parts In-Stock

1+ parts

$29.187

100+ parts

$26.852

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2,120

$29.187

$26.852

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ChromeModa Solutions

Germany . 4,367 parts In-Stock

1+ parts

$29.783

100+ parts

$24.422

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4,367

$29.783

$24.422

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IDEA Electronic Components Group

UK . 2,010 parts In-Stock

1+ parts

$29.783

100+ parts

$28.294

1k+ parts

$26.805

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2,010

$29.783

$28.294

$26.805

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One Stop Electronics

USA . 1,369 parts In-Stock

1+ parts

$35.000

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1,369

$35.000

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Corphita

USA . 3,019 parts In-Stock

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3,019

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Microchip USA

USA . 229 parts In-Stock

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Overview

Experience the power of innovation with the LM3S2637-EQC50-A2 by Texas Instruments, a cutting-edge microcontroller designed for a wide range of applications. With Texas Instruments' renowned quality and expertise in the industry, this product offers unmatched value to customers. Whether you're looking to enhance your automation systems, control devices, or IoT projects, the LM3S2637-EQC50-A2 delivers superior performance and reliability. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making this product suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and enabling integration into smaller devices.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75V ensures energy efficiency and compatibility with low power applications.

Package Shape: SQUARE

The square package shape ensures easy mounting and alignment on the PCB, simplifying the manufacturing process.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high processing capacity and performance for complex applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply options at 2.5V and 3.3V allows for flexibility in design and compatibility with various power sources.

No. of Terminals: 100

Having a high number of terminals enables connectivity to a wide range of external components and peripherals, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Operating at a minimum supply voltage of 2.25V ensures reliable performance even under low power conditions.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this microcontroller is suitable for industrial applications requiring high temperature tolerance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this microcontroller suitable for use in extreme cold environments.

Terminal Finish: TIN

The use of tin terminal finish provides good solderability and conductivity, ensuring reliable electrical connections.

ADC Channels: YES

The presence of ADC channels allows for analog signal conversion, enabling the microcontroller to interface with sensors and other analog devices.

Terminal Position: QUAD

Quad terminal position facilitates easy placement and soldering on the PCB, improving manufacturing efficiency.

ROM Words: 131072

With a ROM size of 131072 words, this microcontroller offers ample memory for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Having a maximum seated height of 1.6mm allows for a slim and compact design, suitable for applications with height restrictions.

Width: 14 mm

The 14mm width of the microcontroller enables easy integration into standard PCB layouts and designs.

Maximum Clock Frequency: 0.032 MHz

Operating at a maximum clock frequency of 0.032MHz, this microcontroller offers fast processing speed for real-time applications.

Length: 14 mm

The 14mm length of the microcontroller contributes to its compact form factor, making it suitable for small and portable devices.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this microcontroller meets the reliability and durability requirements of industrial-grade applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and efficiency in executing instructions, making it well-suited for embedded systems.

RAM Bytes: 32768

With 32768 bytes of RAM, this microcontroller provides sufficient memory for temporary data storage during program execution.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable solder connections, enhancing the overall durability of the microcontroller.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures stability and compatibility with common power sources in electronic devices.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, enabling the microcontroller to drive motors and control devices with varying voltage levels.

ROM Programmability: FLASH

Featuring flash ROM programmability, this microcontroller supports reprogramming of firmware and data, enhancing flexibility and versatility in applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables high-density mounting on the PCB, reducing footprint and facilitating miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller can withstand moderate exposure to moisture during manufacturing and operation, ensuring reliability in humid environments.

Speed: 50 rpm

The speed of 50 rpm indicates the maximum clock speed at which this microcontroller can operate effectively, meeting the performance requirements of various applications.

No. of I/O Lines: 46

Having 46 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S2637-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2637-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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