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LM3S2620-IQC25-A2

Texas Instruments

LM3S2620-IQC25-A2 by Texas Instruments

Texas Instruments LM3S2620-IQC25-A2 is a 32-bit Cortex-M3 microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at up to 25 MHz, has PWM(4), QEI, TIMER(4), WDT peripherals, and supports CAN(2), I2C, SSI, UART connectivity. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$17.200

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 270 parts In-Stock

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$17.200

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270

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$17.200

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Distributors (In-Stock)

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Vyrian

USA . 7,235 parts In-Stock

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7,235

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Digiode

USA . 4,818 parts In-Stock

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4,818

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Chip Stock

USA . 223 parts In-Stock

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223

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Distributors (Availability)

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AZTECH Wire

Italy . 865 parts In-Stock

1+ parts

$10.260

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865

$10.260

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Parana Technologies

USA . 664 parts In-Stock

1+ parts

$43.070

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664

$43.070

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ChromeModa Solutions

Germany . 2,182 parts In-Stock

1+ parts

$48.393

100+ parts

$39.682

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2,182

$48.393

$39.682

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IDEA Electronic Components Group

UK . 476 parts In-Stock

1+ parts

$48.393

100+ parts

$45.973

1k+ parts

$43.554

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476

$48.393

$45.973

$43.554

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$48.414

100+ parts

$44.057

1k+ parts

$39.699

10k+ parts

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500

$48.414

$44.057

$39.699

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Microchip USA

USA . 403 parts In-Stock

1+ parts

$63.500

100+ parts

$62.950

1k+ parts

$62.950

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$62.400

403

$63.500

$62.950

$62.950

$62.400

Corphita

USA . 1,855 parts In-Stock

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1,855

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DigiPath Technology Company

USA . 1,451 parts In-Stock

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$43.631

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1,451

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$43.631

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience unparalleled performance and reliability with the LM3S2620-IQC25-A2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line microcontrollers like this one, designed for a wide range of applications. With integrated cache, multiple power supplies, and a variety of peripherals, this microcontroller offers unmatched value and versatility to customers. Whether you're working on industrial automation, robotics, or IoT projects, the LM3S2620-IQC25-A2 provides the performance and efficiency you need to bring your designs to life. Trust in Texas Instruments to deliver exceptional quality and innovation with every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance of the microcontroller by reducing access time to frequently used data and instructions.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation of the microcontroller within specified voltage limits, preventing damage due to voltage spikes.

On Chip Data RAM Width: 8

An on-chip data RAM width of 8 bits allows for efficient data processing and manipulation within the microcontroller, enhancing its performance capabilities.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family signifies that the microcontroller is based on an efficient and powerful architecture, providing high performance and low power consumption.

ROM Words: 131072

With a large ROM capacity of 131072 words, the microcontroller can store a significant amount of program instructions, enabling the implementation of complex algorithms and applications.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities to a wide range of applications that require analog data processing.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency of 25 MHz enables the microcontroller to execute instructions at a faster rate, leading to improved overall performance and responsiveness.

Connectivity: CAN(2), I2C, SSI, UART

Support for various connectivity options such as CAN, I2C, SSI, and UART makes the microcontroller versatile and suitable for communication with a wide range of peripheral devices and interfaces.

No. of I/O Lines: 52

Having a high number of I/O lines allows for efficient interfacing with external devices and peripherals, making the microcontroller suitable for complex control and communication tasks.

Technical Specifications

Microcontrollers LM3S2620-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C, SSI, UART

Peripherals:

PWM(4), QEI, TIMER(4), WDT

Trade Compliance

LM3S2620-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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