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LM3S2608-IQC50-A2

Texas Instruments

LM3S2608-IQC50-A2 by Texas Instruments

Texas Instruments LM3S2608-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications with CAN, I2C, SSI, UART connectivity and low power mode. Operating temperature range from -40 to 85°C makes it suitable for various environments.

Median Price

$21.868

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$21.868

1k+ parts

$19.709

10k+ parts

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28

-

$21.868

$19.709

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Distributors (In-Stock)

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Vyrian

USA . 7,634 parts In-Stock

1+ parts

-

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7,634

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Digiode

USA . 875 parts In-Stock

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875

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Bristol Electronics

USA . 70 parts In-Stock

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70

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Kiltronic GmbH

Germany . 48 parts In-Stock

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48

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Distributors (Availability)

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One Stop Electronics

USA . 1,496 parts In-Stock

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$13.000

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-

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1,496

$13.000

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AZTECH Wire

Italy . 1,149 parts In-Stock

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$17.780

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$17.780

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Ampacity Inc.

Singapore . 1,400 parts In-Stock

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$22.000

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$22.000

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Parana Technologies

USA . 905 parts In-Stock

1+ parts

$39.554

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905

$39.554

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DigiPath Technology Company

USA . 415 parts In-Stock

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$43.554

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415

$43.554

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ChromeModa Solutions

Germany . 5,625 parts In-Stock

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$44.443

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$36.443

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5,625

$44.443

$36.443

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IDEA Electronic Components Group

UK . 1,820 parts In-Stock

1+ parts

$44.443

100+ parts

$42.221

1k+ parts

$39.999

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1,820

$44.443

$42.221

$39.999

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Microchip USA

USA . 1,758 parts In-Stock

1+ parts

$77.440

100+ parts

$76.090

1k+ parts

$75.420

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$74.750

1,758

$77.440

$76.090

$75.420

$74.750

Lixinc

USA . 18,450 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,128 parts In-Stock

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1,128

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Corphita

USA . 911 parts In-Stock

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911

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Kepictronics

USA . 312 parts In-Stock

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312

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GreenTree Electronics

Israel . 300 parts In-Stock

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300

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Experience the power and reliability of Texas Instruments with the LM3S2608-IQC50-A2 microcontroller. This versatile device offers seamless integration, high performance, and a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With advanced features like integrated cache and low power mode, this microcontroller delivers exceptional value and efficiency to meet your project needs. Trust Texas Instruments for quality products that drive innovation and excellence in technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the microcontroller, ensuring reliability and durability.

Integrated Cache: YES

Integrated cache improves processing speed by storing frequently accessed data, enhancing the overall performance of the microcontroller.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75 V ensures energy efficiency and prevents damage to the microcontroller from overvoltage.

On Chip Data RAM Width: 8

Having a data RAM width of 8 bits allows for efficient data processing and storage, enhancing the microcontroller's capabilities.

Package Shape: SQUARE

Square packages are easier to handle and mount, making the microcontroller more user-friendly during installation.

Bit Size: 32

With a bit size of 32, the microcontroller can handle complex calculations and large amounts of data, suitable for a wide range of applications.

Power Supplies (V): 2.5,3.3

Supporting multiple power supply options gives flexibility in designing circuits and allows compatibility with different systems.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options, allowing for versatile integration of peripherals and external devices.

Minimum Supply Voltage: 2.25 V

Operating within a minimum supply voltage of 2.25 V ensures stable performance and prevents issues related to under-voltage conditions.

Maximum Operating Temperature: 85 °C

Being able to operate at temperatures up to 85°C makes the microcontroller suitable for industrial applications where high temperatures may be encountered.

CPU Family: CORTEX-M3

Belonging to the CORTEX-M3 CPU family indicates a reliable and well-established architecture, ensuring efficient performance and compatibility with various software.

Technical Specifications

Microcontrollers LM3S2608-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), SSI(2), UART(2)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S2608-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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