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LM3S2608-IBZ50-A2

Texas Instruments

LM3S2608-IBZ50-A2 by Texas Instruments

LM3S2608-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC channels. With a package style of GRID ARRAY and terminal pitch of 0.8 mm, it offers versatile connectivity options in compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,845 parts In-Stock

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3,845

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Digiode

USA . 1,576 parts In-Stock

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1,576

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Distributors (Availability)

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AZTECH Wire

Italy . 726 parts In-Stock

1+ parts

$15.496

100+ parts

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726

$15.496

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One Stop Electronics

USA . 1,519 parts In-Stock

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$19.000

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1,519

$19.000

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Parana Technologies

USA . 542 parts In-Stock

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$19.441

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$19.452

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542

$19.441

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$19.452

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DigiPath Technology Company

USA . 970 parts In-Stock

1+ parts

$21.407

100+ parts

$19.695

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970

$21.407

$19.695

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ChromeModa Solutions

Germany . 1,902 parts In-Stock

1+ parts

$21.844

100+ parts

$17.912

1k+ parts

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1,902

$21.844

$17.912

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IDEA Electronic Components Group

UK . 418 parts In-Stock

1+ parts

$21.844

100+ parts

$20.752

1k+ parts

$19.660

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418

$21.844

$20.752

$19.660

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$35.047

100+ parts

$31.893

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$28.739

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3,000

$35.047

$31.893

$28.739

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Microchip USA

USA . 2,651 parts In-Stock

1+ parts

$47.270

100+ parts

$46.450

1k+ parts

$46.040

10k+ parts

$45.630

2,651

$47.270

$46.450

$46.040

$45.630

Corphita

USA . 3,909 parts In-Stock

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3,909

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Overview

Experience the cutting-edge technology of the LM3S2608-IBZ50-A2 by Texas Instruments, a top-tier manufacturer known for delivering high-quality microcontrollers. This versatile product offers unmatched value with its wide range of applications in various industries. From automotive to industrial automation, this microcontroller provides superior performance and reliability. With features like ADC channels, PWM channels, and a 32-bit architecture, customers can expect seamless operation and enhanced functionality. Trust Texas Instruments to deliver innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range for reliable performance.

Package Shape: SQUARE

Facilitates easy placement on the PCB and efficient use of space.

Bit Size: 32

Offers high processing power and capability for complex tasks.

Power Supplies (V): 2.5,3.3

Compatibility with multiple power supplies for flexibility in design.

No. of Terminals: 108

Provides a wide range of connectivity options for external components.

Package Style (Meter): GRID ARRAY

Enhances thermal performance and solder joint reliability.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even under low voltage conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent electrical conductivity and corrosion resistance.

ADC Channels: YES

Allows for analog input and conversion, expanding the range of supported sensors.

Terminal Position: BOTTOM

Facilitates easy soldering and connection to the PCB.

ROM Words: 131072

Offers ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Low profile design for compact device applications.

Width: 10 mm

Compact form factor for space-constrained designs.

Maximum Clock Frequency: 0.032 MHz

Provides high-speed processing capability for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly processes.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes.

Length: 10 mm

Compact size for efficient PCB layout.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for high performance and efficiency.

RAM Bytes: 32768

Sufficient random-access memory for data storage and manipulation.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: BALL

Simplifies soldering and connection to the PCB.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for reliable operation.

PWM Channels: YES

Supports pulse-width modulation for precise control of connected devices.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM memory.

Terminal Pitch: 0.8 mm

Optimal spacing for efficient PCB layout and soldering.

Moisture Sensitivity Level (MSL): 3

Suitable for standard surface mount assembly processes.

Speed: 50 rpm

Capable of handling high-speed processing tasks.

No. of I/O Lines: 52

Provides ample input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S2608-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2608-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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