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LM3S2608-EQC50-A2

Texas Instruments

LM3S2608-EQC50-A2 by Texas Instruments

Texas Instruments LM3S2608-EQC50-A2 is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it offers 52 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,296 parts In-Stock

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Digiode

USA . 2,419 parts In-Stock

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AZTECH Wire

Italy . 385 parts In-Stock

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$11.065

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385

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One Stop Electronics

USA . 603 parts In-Stock

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$26.000

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603

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Parana Technologies

USA . 1,828 parts In-Stock

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$69.266

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ChromeModa Solutions

Germany . 5,608 parts In-Stock

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$77.827

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$63.818

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5,608

$77.827

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IDEA Electronic Components Group

UK . 1,463 parts In-Stock

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$77.827

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$73.936

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$70.044

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1,463

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$73.936

$70.044

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QUARKTWIN TECHNOLOGY LTD

USA . 25,563 parts In-Stock

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Corphita

USA . 3,460 parts In-Stock

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DigiPath Technology Company

USA . 1,989 parts In-Stock

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$70.169

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Microchip USA

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Overview

Experience the innovation and reliability of Texas Instruments with the LM3S2608-EQC50-A2 microcontroller. This powerful device offers unmatched performance in a compact package, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers the precision and efficiency you need. Trust in Texas Instruments to provide top-quality products that meet your needs and exceed your expectations. Upgrade your projects today with the LM3S2608-EQC50-A2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides protection to the internal components of the microcontroller.

Surface Mount: YES

Surface mount technology makes the microcontroller easy to assemble on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 2.75 V

Operates at a maximum supply voltage of 2.75 V, making it suitable for low-power applications.

Bit Size: 32

With a bit size of 32, this microcontroller can handle complex calculations and processing tasks efficiently.

Power Supplies (V): 2.5,3.3

Supports power supplies of 2.5V and 3.3V, providing flexibility in different voltage requirements for applications.

No. of Terminals: 100

With 100 terminals, this microcontroller offers a wide range of connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK

The FLATPACK package style allows for easy integration into electronic systems and provides a compact form factor.

Minimum Supply Voltage: 2.25 V

Operates at a minimum supply voltage of 2.25 V, ensuring stable performance even at lower power levels.

Maximum Operating Temperature: 105 °C

Capable of operating at high temperatures up to 105°C, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can withstand extremely cold temperatures down to -40°C, ensuring reliable operation in various environmental conditions.

ADC Channels: YES

Integrated ADC channels allow for analog input signals to be converted into digital data, expanding the microcontroller's capabilities.

Terminal Position: QUAD

Quad terminal position provides easy access and connection to external components, enhancing the microcontroller's usability.

ROM Words: 131072

With 131072 ROM words, this microcontroller offers ample memory for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm allows for a slim and compact design, ideal for space-constrained applications.

Width: 14 mm

Compact width of 14 mm makes the microcontroller suitable for small form factor devices and PCB layouts.

Maximum Clock Frequency: 0.032 MHz

Operates at a maximum clock frequency of 0.032 MHz, providing sufficient processing speed for various applications.

Length: 14 mm

Short length of 14 mm contributes to the overall compactness of the microcontroller, making it easy to integrate into system designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature grade ensures reliable operation in harsh industrial environments with wide temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller peripheral IC type offer efficient processing capabilities and versatile functionality for diverse applications.

RAM Bytes: 32768

32768 RAM bytes provide ample working memory for data storage and manipulation, enhancing the microcontroller's performance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and connection to PCBs, simplifying the assembly process and ensuring robust electrical connections.

Nominal Supply Voltage: 2.5 V

With a nominal supply voltage of 2.5 V, this microcontroller operates efficiently within the specified voltage range.

PWM Channels: YES

Integrated PWM channels enable precise control of pulse-width modulation signals, enhancing the microcontroller's capabilities for motor control and power regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible reprogramming of the microcontroller, supporting iterative development and firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting on PCBs, maximizing component placement efficiency and miniaturization of electronic devices.

Speed: 50 rpm

Operates at a maximum speed of 50 rpm, providing sufficient processing performance for real-time control applications and data processing tasks.

No. of I/O Lines: 52

With 52 I/O lines, this microcontroller offers versatile input/output capabilities for interfacing with external devices and sensors, enhancing system connectivity.

Technical Specifications

Microcontrollers LM3S2608-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2608-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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