Loading...

LM3S2601-EQC50-A2T

Texas Instruments

LM3S2601-EQC50-A2T by Texas Instruments

LM3S2601-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 50 MHz, it features PWM channels and 60 I/O lines, making it ideal for industrial applications requiring high-speed processing and extensive input/output capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,822

-

-

-

-

Digiode

USA . 2,934 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,934

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 411 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$3.000

-

-

-

AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$8.514

100+ parts

-

1k+ parts

-

10k+ parts

-

351

$8.514

-

-

-

One Stop Electronics

USA . 1,003 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,003

$17.000

-

-

-

Semicontronic

India . 1,467 parts In-Stock

1+ parts

$18.000

100+ parts

$17.550

1k+ parts

$17.460

10k+ parts

-

1,467

$18.000

$17.550

$17.460

-

Parana Technologies

USA . 1,953 parts In-Stock

1+ parts

$46.244

100+ parts

-

1k+ parts

-

10k+ parts

-

1,953

$46.244

-

-

-

DigiPath Technology Company

USA . 2,356 parts In-Stock

1+ parts

$50.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,356

$50.920

-

-

-

ChromeModa Solutions

Germany . 6,360 parts In-Stock

1+ parts

$51.959

100+ parts

$42.606

1k+ parts

-

10k+ parts

-

6,360

$51.959

$42.606

-

-

IDEA Electronic Components Group

UK . 585 parts In-Stock

1+ parts

$51.959

100+ parts

$49.361

1k+ parts

$46.763

10k+ parts

-

585

$51.959

$49.361

$46.763

-

Corphita

USA . 4,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,587

-

-

-

-

Microchip USA

USA . 391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

391

-

-

-

-

Corohmni

South Africa . 52 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

52

-

-

-

-

Overview

Experience the power and precision of the Texas Instruments LM3S2601-EQC50-A2T microcontroller, a cutting-edge solution for your electronic projects. Crafted with expert engineering and quality materials, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, from robotics to IoT devices, this microcontroller delivers seamless integration, enhanced functionality, and efficient operation. Embrace innovation and elevate your projects with the LM3S2601-EQC50-A2T by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection for the microcontroller, making it durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing costs.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and protects the microcontroller from overvoltage.

Bit Size: 32

A 32-bit microcontroller can process larger data sizes and perform more complex tasks compared to lower bit microcontrollers.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with different systems.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and compact design, ideal for space-constrained applications.

Maximum Clock Frequency: 50 MHz

A high maximum clock frequency of 50MHz allows for fast data processing and high performance capabilities.

RAM Bytes: 32768

With a large RAM size of 32768 bytes, this microcontroller can efficiently handle data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and good scalability, making it suitable for a wide range of applications.

ROM Programmability: FLASH

The flash ROM programmability allows for easy firmware updates and reprogramming, enhancing versatility and adaptability.

Technical Specifications

Microcontrollers LM3S2601-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2601-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20