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LM3S2533-IQC50-A2T

Texas Instruments

LM3S2533-IQC50-A2T by Texas Instruments

Texas Instruments LM3S2533-IQC50-A2T is a 32-bit microcontroller with 98304 ROM words and 65536 RAM bytes. Operating at -40 to 85°C, it has PWM channels, ADC support, and runs on 2.25-2.75V supplies. Ideal for industrial applications requiring a compact form factor and high clock frequency of 0.032 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,674 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,674

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Digiode

USA . 3,436 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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3,436

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$6.841

100+ parts

-

1k+ parts

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10k+ parts

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244

$6.841

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One Stop Electronics

USA . 1,402 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

-

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1,402

$15.000

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Microchip USA

USA . 2,821 parts In-Stock

1+ parts

$38.880

100+ parts

$38.330

1k+ parts

$38.050

10k+ parts

$37.770

2,821

$38.880

$38.330

$38.050

$37.770

Parana Technologies

USA . 1,414 parts In-Stock

1+ parts

$51.247

100+ parts

-

1k+ parts

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10k+ parts

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1,414

$51.247

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DigiPath Technology Company

USA . 1,825 parts In-Stock

1+ parts

$56.429

100+ parts

$51.915

1k+ parts

-

10k+ parts

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1,825

$56.429

$51.915

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ChromeModa Solutions

Germany . 2,917 parts In-Stock

1+ parts

$57.581

100+ parts

$47.216

1k+ parts

-

10k+ parts

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2,917

$57.581

$47.216

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IDEA Electronic Components Group

UK . 221 parts In-Stock

1+ parts

$57.581

100+ parts

$54.702

1k+ parts

$51.823

10k+ parts

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221

$57.581

$54.702

$51.823

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Corphita

USA . 3,872 parts In-Stock

1+ parts

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3,872

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Overview

Unlock the power of innovation with the LM3S2533-IQC50-A2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that are reliable and efficient. Perfect for a wide range of applications, this microcontroller offers unmatched performance and flexibility. Experience seamless integration and enhanced functionality with the LM3S2533-IQC50-A2T, providing you with the value and benefits you need to take your projects to the next level. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, helping to conserve energy and extend battery life.

Package Shape: SQUARE

Facilitates efficient PCB design and layout, optimizing space utilization.

Bit Size: 32

Offers high computational capabilities and processing power, ideal for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Provides flexibility in power options, enabling compatibility with various systems and devices.

No. of Terminals: 100

Offers a sufficient number of connections for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Allows for easy integration into PCB layouts, enhancing overall design aesthetics.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even under low voltage conditions, maintaining consistent performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be encountered, ensuring reliable operation.

Minimum Operating Temperature: -40 °C

Ideal for applications in cold environments, providing reliable performance in extreme conditions.

Terminal Finish: TIN

Provides corrosion resistance and reliable electrical connections, ensuring long-term functionality.

ADC Channels: YES

Allows for analog signal processing, enabling the microcontroller to interface with a variety of sensors and devices.

Terminal Position: QUAD

Facilitates easy PCB mounting and soldering, enhancing assembly efficiency.

ROM Words: 98304

Offers ample memory storage for program code and data, supporting complex applications and algorithms.

Maximum Seated Height: 1.6 mm

Enables compact and slim designs, ideal for space-constrained applications.

Width: 14 mm

Compact size for easy integration into various electronic devices and systems.

Maximum Clock Frequency: 0.032 MHz

Provides high-speed processing capabilities, supporting real-time applications and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Optimizes manufacturing processes by allowing efficient reflow soldering, reducing production time.

Peak Reflow Temperature °C: 260

Ensures reliable solder joints during assembly processes, contributing to the overall quality and durability of the product.

Length: 14 mm

Compact size for space-efficient PCB layouts and designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with demanding operating conditions, ensuring long-term reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and power efficiency, ideal for a wide range of applications.

RAM Bytes: 65536

Provides ample random-access memory for data storage and manipulation, supporting multitasking and complex operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency and reliability.

Terminal Form: GULL WING

Facilitates easy soldering and connections, enhancing the robustness of the microcontroller.

Nominal Supply Voltage: 2.5 V

Optimal voltage level for consistent and reliable performance, ensuring stable operation.

PWM Channels: YES

Allows for precise control of analog signals, essential for applications requiring modulation and regulation.

ROM Programmability: FLASH

Flash memory enables easy reprogramming and updating of firmware, supporting versatile and adaptable applications.

Terminal Pitch: 0.5 mm

Provides fine pitch spacing for compact PCB layouts, optimizing space utilization.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes, ensuring reliable solder joints during manufacturing.

Speed: 50 rpm

Provides efficient processing capabilities, supporting real-time operations and tasks.

No. of I/O Lines: 48

Offers a sufficient number of input/output connections for interfacing with external devices and peripherals, enhancing versatility.

Technical Specifications

Microcontrollers LM3S2533-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2533-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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