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LM3S2533-EQC50-A2T

Texas Instruments

LM3S2533-EQC50-A2T by Texas Instruments

LM3S2533-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 48 I/O lines, 65536 RAM bytes, and 98304 ROM words. It operates in industrial temperatures (-40 to 105 °C) and features PWM channels for various applications. With a max clock frequency of 0.032 MHz, it is suitable for embedded systems requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,483 parts In-Stock

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3,483

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Digiode

USA . 3,195 parts In-Stock

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3,195

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Distributors (Availability)

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One Stop Electronics

USA . 1,196 parts In-Stock

1+ parts

$12.000

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1,196

$12.000

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AZTECH Wire

Italy . 769 parts In-Stock

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$12.525

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769

$12.525

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Parana Technologies

USA . 1,162 parts In-Stock

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$44.969

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$44.969

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DigiPath Technology Company

USA . 1,620 parts In-Stock

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$49.516

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1,620

$49.516

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IDEA Electronic Components Group

UK . 1,896 parts In-Stock

1+ parts

$50.527

100+ parts

$48.001

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$45.474

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1,896

$50.527

$48.001

$45.474

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ChromeModa Solutions

Germany . 1,548 parts In-Stock

1+ parts

$50.527

100+ parts

$41.432

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1,548

$50.527

$41.432

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Corphita

USA . 1,319 parts In-Stock

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1,319

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Microchip USA

USA . 357 parts In-Stock

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357

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Overview

Experience the power of innovation with the LM3S2533-EQC50-A2T microcontroller by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers cutting-edge technology for various applications in the microcontroller category. This high-performance device provides customers with unmatched value, benefits, and advantages. From its advanced features to its efficient design, the LM3S2533-EQC50-A2T is the perfect solution for all your electronic needs. Elevate your projects with this top-of-the-line microcontroller and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Maximum Supply Voltage: 2.75 V

Allows for a stable power supply without exceeding the maximum voltage.

Bit Size: 32

Offers a high level of processing capability for complex tasks.

ROM Words: 98304

Large ROM capacity for storing and running programs efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient performance for embedded systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

PWM Channels: YES

Pulse Width Modulation allows for precise control of signals and voltage levels.

No. of I/O Lines: 48

Sufficient I/O lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2533-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2533-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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