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LM3S2533-EQC50-A2

Texas Instruments

LM3S2533-EQC50-A2 by Texas Instruments

LM3S2533-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 48 I/O lines, 65536 bytes of RAM, and 98304 ROM words. It operates in industrial temperatures (-40 to 105°C) and features PWM channels for various applications requiring a max clock frequency of 0.032 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,142 parts In-Stock

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Digiode

USA . 1,073 parts In-Stock

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1,073

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Distributors (Availability)

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One Stop Electronics

USA . 232 parts In-Stock

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$9.000

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$9.000

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AZTECH Wire

Italy . 840 parts In-Stock

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$14.611

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840

$14.611

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Parana Technologies

USA . 2,294 parts In-Stock

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$29.701

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$62.215

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$29.701

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DigiPath Technology Company

USA . 58 parts In-Stock

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$32.705

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$30.088

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58

$32.705

$30.088

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ChromeModa Solutions

Germany . 5,781 parts In-Stock

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$33.372

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$27.365

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5,781

$33.372

$27.365

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IDEA Electronic Components Group

UK . 1,192 parts In-Stock

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$33.372

100+ parts

$31.703

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$30.035

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1,192

$33.372

$31.703

$30.035

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Corphita

USA . 4,534 parts In-Stock

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Microchip USA

USA . 220 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S2533-EQC50-A2 microcontroller by Texas Instruments. Crafted with top-notch quality, this versatile device is perfect for a wide range of applications. From robotics to IoT devices, this microcontroller offers unparalleled value and benefits to customers. With its advanced technology and reliable performance, you can trust Texas Instruments to deliver cutting-edge solutions that will take your projects to the next level. Embrace innovation and let the LM3S2533-EQC50-A2 empower your creativity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and electrical insulation for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing processes.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and prevents damage to the microcontroller.

Package Shape: SQUARE

The square package shape helps in efficient board layout and space utilization, making it ideal for compact electronic designs.

Bit Size: 32

The 32-bit architecture provides high performance and processing capabilities, making the microcontroller suitable for complex tasks.

Power Supplies (V): 2.5,3.3

Having multiple power supply options allows for flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 100

The high number of terminals enables connectivity to a wide range of peripherals and components, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style offers ease of handling and installation, making it a convenient choice for assembly and maintenance.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation and performance even under low power conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the microcontroller to function in harsh environments and industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extremely cold conditions, making it suitable for diverse environments.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, enhancing the longevity and reliability of the connections.

ADC Channels: YES

Having ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position provides uniform spacing and alignment for easy integration into PCB layouts, facilitating smooth assembly.

ROM Words: 98304

With a large ROM capacity of 98304 words, the microcontroller can store extensive program code and data, catering to complex applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for compact and slim device designs, making the microcontroller suitable for space-constrained applications.

Width: 14 mm

The moderate width of 14 mm offers a balance between space efficiency and ease of handling during assembly and integration.

Maximum Clock Frequency: 0.032 MHz

Although the clock frequency is relatively low, it can be beneficial for power-saving applications and tasks that do not require high-speed processing.

Length: 14 mm

The compact length of 14 mm complements the square package shape, enabling efficient board utilization and compact system designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the microcontroller's reliability and stability in demanding environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers efficient processing and execution of instructions, enhancing overall performance.

RAM Bytes: 65536

The generous RAM capacity of 65536 bytes allows for efficient data storage and manipulation, supporting multitasking and complex algorithms.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints, ensuring robust connections and reliable functionality.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides a stable operating voltage for the microcontroller, ensuring consistent performance.

PWM Channels: YES

Having PWM channels allows for precise control of analog signals, enabling the microcontroller to drive motors, LEDs, and other devices with varying voltages.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and software, allowing for easy customization and maintenance of the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enhances connectivity density and allows for more terminals in a smaller area, maximizing functionality in limited space.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling and storage precautions to maintain the integrity of the microcontroller.

Speed: 50 rpm

The speed of 50 revolutions per minute (rpm) may be relevant for specific motor control applications or tasks that involve rotational movements.

No. of I/O Lines: 48

The high number of I/O lines provides extensive connectivity for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LM3S2533-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2533-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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