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LM3S2432-IBZ50-A2

Texas Instruments

LM3S2432-IBZ50-A2 by Texas Instruments

LM3S2432-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a clock frequency of 0.032 MHz. It features 32768 bytes of RAM, 98304 ROM words, and PWM channels for industrial applications requiring RISC technology.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,811 parts In-Stock

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Digiode

USA . 3,983 parts In-Stock

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One Stop Electronics

USA . 684 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 628 parts In-Stock

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$15.436

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Parana Technologies

USA . 1,382 parts In-Stock

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$21.716

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$22.156

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$21.716

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DigiPath Technology Company

USA . 298 parts In-Stock

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$23.912

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$21.999

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ChromeModa Solutions

Germany . 3,439 parts In-Stock

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$24.400

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$20.008

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$24.400

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IDEA Electronic Components Group

UK . 1,978 parts In-Stock

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$24.400

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$23.180

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$21.960

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Microchip USA

USA . 2,278 parts In-Stock

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$47.230

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$46.560

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$46.220

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$45.880

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Component Stockers USA

USA . 187 parts In-Stock

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$212.190

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Corphita

USA . 463 parts In-Stock

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Overview

Experience the next level of performance and reliability with the LM3S2432-IBZ50-A2 microcontroller from Texas Instruments. Designed with high-quality materials and cutting-edge technology, this device is perfect for a wide range of applications. Whether you're working on automation, industrial control, or consumer electronics, this microcontroller offers unmatched value with its fast clock frequency, ample memory, and versatile I/O capabilities. Trust Texas Instruments to deliver top-notch products that meet your needs and exceed your expectations. Upgrade to the LM3S2432-IBZ50-A2 today and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a low voltage range, making it suitable for energy-efficient applications.

Package Shape: SQUARE

Square package shape allows for easy placement and alignment on circuit boards, optimizing space usage.

Bit Size: 32

32-bit architecture provides higher processing power and efficiency compared to lower bit sizes, enabling faster and more complex operations.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, offering flexibility in different application scenarios.

No. of Terminals: 108

High number of terminals allow for more connections and functionalities, making it suitable for diverse use cases.

Package Style (Meter): GRID ARRAY

Grid array package style provides a stable and secure connection between the microcontroller and the circuit board.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing versatility.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality.

ROM Words: 98304

Large ROM capacity allows for storing extensive program codes and data, accommodating complex applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency ensures swift processing and operation, suitable for time-sensitive tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller enhances performance and efficiency, making it a powerful computing solution.

RAM Bytes: 32768

Generous RAM capacity enables efficient data processing and storage, enhancing overall system performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring energy efficiency and reliable operation.

Technical Specifications

Microcontrollers LM3S2432-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2432-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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