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LM3S2412-EQC25-A2T

Texas Instruments

LM3S2412-EQC25-A2T by Texas Instruments

Texas Instruments' LM3S2412-EQC25-A2T is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. Operating at up to 0.032 MHz, it features 49 I/O lines, PWM channels, and ADC channels for industrial applications requiring a temperature range of -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,465 parts In-Stock

1+ parts

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7,465

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Digiode

USA . 4,468 parts In-Stock

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4,468

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,041 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,041

$9.000

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AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$18.687

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654

$18.687

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Parana Technologies

USA . 1,986 parts In-Stock

1+ parts

$32.859

100+ parts

-

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$113.585

10k+ parts

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1,986

$32.859

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$113.585

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DigiPath Technology Company

USA . 469 parts In-Stock

1+ parts

$36.182

100+ parts

$33.287

1k+ parts

-

10k+ parts

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469

$36.182

$33.287

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ChromeModa Solutions

Germany . 5,327 parts In-Stock

1+ parts

$36.920

100+ parts

$30.274

1k+ parts

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5,327

$36.920

$30.274

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IDEA Electronic Components Group

UK . 2,286 parts In-Stock

1+ parts

$36.920

100+ parts

$35.074

1k+ parts

$33.228

10k+ parts

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2,286

$36.920

$35.074

$33.228

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Microchip USA

USA . 5,774 parts In-Stock

1+ parts

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5,774

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Corphita

USA . 4,132 parts In-Stock

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4,132

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Overview

Unleash the power of innovation with the LM3S2412-EQC25-A2T by Texas Instruments, a cutting-edge microcontroller designed to elevate your projects to new heights. Crafted with precision and excellence, Texas Instruments is renowned for delivering top-notch quality products that exceed expectations. This microcontroller is versatile and reliable, making it perfect for a wide range of applications. Experience the seamless integration, high performance, and exceptional value that this product brings to the table. Upgrade your projects today and revolutionize the way you work with the LM3S2412-EQC25-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range, preventing damage to the microcontroller.

Package Shape: SQUARE

Facilitates efficient packing on the PCB, maximizing use of space.

Bit Size: 32

Provides a high level of processing power for complex applications.

Power Supplies (V): 2.5,3.3

Compatible with common power sources, offering flexibility in design.

No. of Terminals: 100

Provides multiple connection points for peripherals, enabling extensive system integration.

Package Style (Meter): FLATPACK

Ensures a streamlined form factor for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Operates reliably even at lower voltages, enhancing energy efficiency.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, offering versatility in deployment.

Terminal Finish: TIN

Enhances conductivity and solderability for robust electrical connections.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing and data acquisition.

Terminal Position: QUAD

Facilitates easy PCB layout and routing for efficient signal flow.

ROM Words: 98304

Offers ample memory storage for program and data storage requirements.

Maximum Seated Height: 1.6 mm

Maintains a low profile for space-constrained designs and compact enclosures.

Width: 14 mm

Compact dimensions enable integration into small form factor devices.

Maximum Clock Frequency: 0.032 MHz

Supports high-speed operation for responsive real-time applications.

Length: 14 mm

Compact form factor for efficient use of board space.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh environmental conditions typical of industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient instruction execution and processing speed.

RAM Bytes: 32768

Provides sufficient memory for data storage and temporary storage of variables.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy PCB soldering and rework with a robust terminal design.

Nominal Supply Voltage: 2.5 V

Operates at a stable voltage level for reliable performance.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog circuits.

ROM Programmability: FLASH

Allows for easy programming and updating of firmware without requiring specialized equipment.

Terminal Pitch: 0.5 mm

Enables high-density mounting on PCBs for compact and efficient designs.

Moisture Sensitivity Level (MSL): 3

Suitable for assembly in standard industrial environments with moderate moisture exposure.

Speed: 25 rpm

Supports high-speed processing for time-critical applications.

No. of I/O Lines: 49

Provides ample input and output options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2412-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2412-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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