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LM3S2412-EQC25-A2

Texas Instruments

LM3S2412-EQC25-A2 by Texas Instruments

LM3S2412-EQC25-A2 by Texas Instruments is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC functionality. With a temperature range from -40 to 105 °C, it offers high performance in compact FLATPACK package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,175 parts In-Stock

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Digiode

USA . 155 parts In-Stock

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155

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Distributors (Availability)

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AZTECH Wire

Italy . 442 parts In-Stock

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$5.513

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442

$5.513

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One Stop Electronics

USA . 920 parts In-Stock

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$22.000

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920

$22.000

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Parana Technologies

USA . 2,185 parts In-Stock

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$37.245

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$37.245

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DigiPath Technology Company

USA . 870 parts In-Stock

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$41.011

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870

$41.011

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ChromeModa Solutions

Germany . 6,835 parts In-Stock

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$41.848

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$34.315

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6,835

$41.848

$34.315

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IDEA Electronic Components Group

UK . 250 parts In-Stock

1+ parts

$41.848

100+ parts

$39.756

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$37.663

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250

$41.848

$39.756

$37.663

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QUARKTWIN TECHNOLOGY LTD

USA . 9,386 parts In-Stock

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Microchip USA

USA . 4,985 parts In-Stock

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Corphita

USA . 2,792 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S2412-EQC25-A2 microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled performance and reliability for a variety of applications. Whether you're designing innovative IoT devices or cutting-edge robotics, this microcontroller's advanced features and high-quality design will help you bring your ideas to life. Experience seamless integration, superior functionality, and exceptional value with the LM3S2412-EQC25-A2. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to external factors, ensuring the product's longevity.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and enhancing the overall performance of the product.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, reducing the risk of damage and ensuring stable performance.

Package Shape: SQUARE

Square package shape makes it easier to design and layout the PCB, optimizing space and simplifying the manufacturing process.

Bit Size: 32

32-bit architecture allows for efficient data processing and higher performance compared to lower bit sizes.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, providing flexibility in different application scenarios.

No. of Terminals: 100

Ample number of terminals allow for connectivity to various external components, expanding the product's capabilities.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile and efficient thermal performance, contributing to the overall reliability of the product.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, the product remains operational even in low power scenarios, ensuring continuous functionality.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range allows for reliable performance in various environmental conditions, increasing the product's versatility.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the product can operate in extreme cold environments, making it suitable for diverse applications.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and corrosion resistance, enhancing the overall reliability of the product.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, enabling the product to interface with a wide range of sensors and devices.

Terminal Position: QUAD

Quad terminal position facilitates easier PCB layout and soldering, improving overall assembly efficiency.

ROM Words: 98304

Large ROM capacity allows for storing a significant amount of program data, enabling complex applications to be run smoothly.

Maximum Seated Height: 1.6 mm

Low seated height makes the product suitable for compact designs and applications where space is limited.

Width: 14 mm

Compact width dimension allows for efficient PCB layout and space-saving integration within electronic systems.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast data processing and overall improved performance in real-time applications.

Length: 14 mm

Compact length dimension contributes to space-saving design solutions and facilitates integration in small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments, making the product suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller peripheral IC offers efficient data processing and lower power consumption, enhancing overall performance.

RAM Bytes: 32768

With a large RAM capacity, the product can handle and store more data in memory, improving the speed and efficiency of operations.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides robust solder joints and mechanical strength, enhancing the overall durability of the product.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable performance, reducing the risk of errors or malfunctions.

PWM Channels: YES

Integrated PWM channels allow for precise control of analog signals, facilitating a wide range of applications in motor control, lighting, and more.

ROM Programmability: FLASH

Flash ROM programmability enables easy and fast updates of firmware or software, offering flexibility and adaptability for the product.

Terminal Pitch: 0.5 mm

Small terminal pitch enables high-density mounting on the PCB, allowing for compact and space-efficient designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the product can withstand moderate exposure to moisture during assembly and storage, ensuring reliability in various environmental conditions.

Speed: 25 rpm

With a speed of 25 rpm, the product can efficiently process data and respond quickly to external inputs, enabling fast and responsive performance.

No. of I/O Lines: 49

Abundant I/O lines allow for versatile connectivity and communication with external devices and peripherals, expanding the product's functionality.

Technical Specifications

Microcontrollers LM3S2412-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2412-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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