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LM3S2410-IQC25-A2

Texas Instruments

LM3S2410-IQC25-A2 by Texas Instruments

Texas Instruments LM3S2410-IQC25-A2 is a 32-bit microcontroller with 32768 RAM bytes and 98304 ROM words. Operating at up to 0.032 MHz, it features 60 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact, low-power package.

Median Price

$11.810

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 84 parts In-Stock

1+ parts

-

100+ parts

$11.810

1k+ parts

$10.570

10k+ parts

$9.940

84

-

$11.810

$10.570

$9.940

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,933 parts In-Stock

1+ parts

$12.474

100+ parts

-

1k+ parts

-

10k+ parts

-

4,933

$12.474

-

-

-

Vyrian

USA . 7,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,769

-

-

-

-

DigiKey Marketplace

USA . 84 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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84

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 980 parts In-Stock

1+ parts

$10.220

100+ parts

-

1k+ parts

-

10k+ parts

-

980

$10.220

-

-

-

Corphita

USA . 2,054 parts In-Stock

1+ parts

$11.817

100+ parts

-

1k+ parts

-

10k+ parts

-

2,054

$11.817

-

-

-

Microchip USA

USA . 269 parts In-Stock

1+ parts

$49.710

100+ parts

$49.000

1k+ parts

$48.650

10k+ parts

$48.290

269

$49.710

$49.000

$48.650

$48.290

Parana Technologies

USA . 1,446 parts In-Stock

1+ parts

$71.706

100+ parts

-

1k+ parts

-

10k+ parts

-

1,446

$71.706

-

-

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ChromeModa Solutions

Germany . 6,252 parts In-Stock

1+ parts

$80.569

100+ parts

$66.067

1k+ parts

-

10k+ parts

-

6,252

$80.569

$66.067

-

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IDEA Electronic Components Group

UK . 1,925 parts In-Stock

1+ parts

$80.569

100+ parts

$76.541

1k+ parts

$72.512

10k+ parts

-

1,925

$80.569

$76.541

$72.512

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DigiPath Technology Company

USA . 1,907 parts In-Stock

1+ parts

-

100+ parts

$72.641

1k+ parts

-

10k+ parts

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1,907

-

$72.641

-

-

Futuretech Components

Singapore . 85 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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85

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Overview

Experience the power of innovation with the LM3S2410-IQC25-A2 microcontroller by Texas Instruments, a leading manufacturer known for its cutting-edge technology and reliability. Designed for a wide range of applications, this microcontroller offers unmatched value and performance. With features like high-speed processing, ample RAM, and multiple I/O lines, this product provides users with the tools needed to bring their projects to life. Trust in Texas Instruments to deliver quality and excellence with every component, making the LM3S2410-IQC25-A2 a smart choice for your next endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for long-term use in various environments.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and prevents damage to the microcontroller under high voltage conditions.

Bit Size: 32

A 32-bit microcontroller offers higher processing capabilities and performance compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages provides flexibility for different power sources and compatibility with various systems.

No. of Terminals: 100

Having a high number of terminals allows for versatile connections and interfaces with other components, expanding the functionality of the microcontroller.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh conditions or industrial settings with elevated temperatures.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to process analog signals, making it suitable for applications that require input from sensors or other analog devices.

ROM Words: 98304

The large ROM capacity of 98304 words allows for storing a significant amount of program code or data, supporting complex algorithms and applications.

RAM Bytes: 32768

With 32768 bytes of RAM, the microcontroller can efficiently handle data storage and manipulation, improving overall performance and responsiveness.

Technical Specifications

Microcontrollers LM3S2410-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2410-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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