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LM3S2410-IBZ25-A2T

Texas Instruments

LM3S2410-IBZ25-A2T by Texas Instruments

LM3S2410-IBZ25-A2T by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 32768 bytes of RAM, 98304 ROM words, and PWM channels for industrial applications requiring RISC technology and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,875 parts In-Stock

1+ parts

-

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8,875

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Digiode

USA . 2,637 parts In-Stock

1+ parts

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-

1k+ parts

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2,637

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 777 parts In-Stock

1+ parts

$4.925

100+ parts

-

1k+ parts

-

10k+ parts

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777

$4.925

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One Stop Electronics

USA . 495 parts In-Stock

1+ parts

$30.000

100+ parts

-

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-

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495

$30.000

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Microchip USA

USA . 2,806 parts In-Stock

1+ parts

$43.610

100+ parts

$42.980

1k+ parts

$42.670

10k+ parts

$42.360

2,806

$43.610

$42.980

$42.670

$42.360

Parana Technologies

USA . 1,773 parts In-Stock

1+ parts

$58.165

100+ parts

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1,773

$58.165

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DigiPath Technology Company

USA . 790 parts In-Stock

1+ parts

$64.047

100+ parts

$58.923

1k+ parts

-

10k+ parts

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790

$64.047

$58.923

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ChromeModa Solutions

Germany . 5,393 parts In-Stock

1+ parts

$65.354

100+ parts

$53.590

1k+ parts

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10k+ parts

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5,393

$65.354

$53.590

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IDEA Electronic Components Group

UK . 2,268 parts In-Stock

1+ parts

$65.354

100+ parts

$62.086

1k+ parts

$58.819

10k+ parts

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2,268

$65.354

$62.086

$58.819

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Corphita

USA . 4,185 parts In-Stock

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4,185

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Overview

Experience unmatched performance and reliability with the LM3S2410-IBZ25-A2T by Texas Instruments. As a leading manufacturer in the microcontroller industry, Texas Instruments delivers cutting-edge technology in a compact package. From industrial automation to consumer electronics, this microcontroller caters to a wide range of applications. With its high-quality design and advanced features, customers can expect seamless operation and optimal efficiency. Upgrade your products today with the LM3S2410-IBZ25-A2T and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides good insulation and protection for the microcontroller, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability makes it easy to integrate the microcontroller into different electronic devices and PCB designs.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage requirement allows for efficient power consumption and compatibility with a range of power sources.

Package Shape: SQUARE

Square package shape facilitates easier placement and soldering on the PCB, improving overall manufacturing efficiency.

Bit Size: 32

32-bit architecture offers enhanced performance, speed, and processing capabilities compared to lower bit microcontrollers.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages enables flexibility in system design and integration with different power sources.

No. of Terminals: 108

Ample terminals provide connectivity options and interfaces for external components, expanding the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient thermal dissipation and mechanical stability, enhancing overall performance and reliability of the microcontroller.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the microcontroller to function reliably in various environmental conditions, making it suitable for diverse applications.

ADC Channels: YES

Built-in analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its range of applications.

ROM Words: 98304

Large ROM capacity allows for storage of significant amounts of program code and data, supporting complex algorithms and applications.

Maximum Seated Height: 1.5 mm

Low seated height enables compact PCB design and integration in space-constrained electronic devices.

Width: 10 mm

Narrow width allows for efficient placement and routing on the PCB, optimizing the overall layout and design of the electronic system.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency offers fast processing speeds and real-time operation for time-critical applications.

RAM Bytes: 32768

Generous RAM capacity provides ample memory for data storage and manipulation, enhancing the microcontroller's performance and versatility.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems and devices.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and space-saving PCB layout, ideal for compact and miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating signifies moderate sensitivity to moisture, ensuring proper handling and storage to maintain the integrity of the microcontroller during manufacturing and assembly.

No. of I/O Lines: 60

Abundant input/output (I/O) lines provide versatile connectivity and interfacing options for external devices, expanding the functionality and capabilities of the microcontroller.

Technical Specifications

Microcontrollers LM3S2410-IBZ25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2410-IBZ25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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