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LM3S2410-EQC25-A2T

Texas Instruments

LM3S2410-EQC25-A2T by Texas Instruments

LM3S2410-EQC25-A2T by Texas Instruments is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and control. With 60 I/O lines and PWM channels, this microcontroller offers versatile connectivity options in a compact flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,601 parts In-Stock

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2,601

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Digiode

USA . 980 parts In-Stock

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980

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 964 parts In-Stock

1+ parts

$6.000

100+ parts

-

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964

$6.000

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AZTECH Wire

Italy . 286 parts In-Stock

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$15.697

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286

$15.697

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Parana Technologies

USA . 291 parts In-Stock

1+ parts

$15.812

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$16.172

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291

$15.812

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$16.172

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DigiPath Technology Company

USA . 484 parts In-Stock

1+ parts

$17.411

100+ parts

$16.018

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484

$17.411

$16.018

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ChromeModa Solutions

Germany . 6,687 parts In-Stock

1+ parts

$17.766

100+ parts

$14.568

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6,687

$17.766

$14.568

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IDEA Electronic Components Group

UK . 808 parts In-Stock

1+ parts

$17.766

100+ parts

$16.878

1k+ parts

$15.989

10k+ parts

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808

$17.766

$16.878

$15.989

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Microchip USA

USA . 4,196 parts In-Stock

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4,196

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Corphita

USA . 1,804 parts In-Stock

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1,804

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Overview

Unlock the potential of your projects with the LM3S2410-EQC25-A2T by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability. Whether you're designing IoT devices, robotics, or industrial automation systems, this powerhouse delivers seamless operation and efficiency. Say goodbye to limitations and embrace endless possibilities with the LM3S2410-EQC25-A2T. Elevate your creations with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to physical damage, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75 V ensures the safety and reliability of the microcontroller.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, making the overall design more compact.

Bit Size: 32

A 32-bit microcontroller offers higher performance and processing power compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in different operating environments.

No. of Terminals: 100

Having 100 terminals allows for a wide range of input and output connections, enabling versatile interfacing with external components.

Package Style (Meter): FLATPACK

Flatpack package style offers easy handling and assembly, contributing to a streamlined manufacturing process.

Minimum Supply Voltage: 2.25 V

A minimum supply voltage of 2.25 V ensures stable operation even under low power conditions.

Maximum Operating Temperature: 105 °C

Operating at a high temperature range of 105°C makes the microcontroller suitable for industrial applications where heat can be a factor.

Minimum Operating Temperature: -40 °C

Being able to operate at temperatures as low as -40°C ensures reliability in extreme cold environments.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, enhancing the overall reliability of the connections.

ADC Channels: YES

Integrated ADC channels allow the microcontroller to convert analog signals to digital data, enabling precise measurement and control tasks.

Terminal Position: QUAD

Quad terminal position provides a stable mechanical connection, reducing the risk of disconnections or signal interference.

ROM Words: 98304

Having 98304 ROM words offers sufficient memory capacity for storing program instructions and data, supporting complex applications.

Maximum Seated Height: 1.6 mm

A low maximum seated height of 1.6 mm ensures compatibility with thin-profile electronic devices and compact designs.

Width: 14 mm

With a width of 14 mm, the microcontroller can fit within narrow spaces on circuit boards, optimizing board layout.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz allows for fast processing and execution of instructions, enhancing overall system performance.

Length: 14 mm

Having a length of 14 mm contributes to the compact form factor of the microcontroller, saving valuable space in the overall system design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers high-speed processing capabilities, making it suitable for demanding applications requiring quick response times.

RAM Bytes: 32768

With 32768 bytes of RAM, the microcontroller can efficiently handle data storage and manipulation, supporting multitasking and data-intensive operations.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making the microcontroller energy efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5 V ensures stability and compatibility with standard power sources.

PWM Channels: YES

Integrated PWM channels allow for precise control of analog signals, enabling functions such as motor control and LED dimming.

ROM Programmability: FLASH

ROM programmability using flash memory allows for easy and flexible reprogramming of the microcontroller, supporting firmware updates and customization.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5 mm enables high-density mounting on circuit boards, optimizing board space and improving overall system efficiency.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent potential damage.

Speed: 25 rpm

With a speed of 25 revolutions per minute, the microcontroller can efficiently process data and execute commands at a consistent pace.

No. of I/O Lines: 60

Having 60 I/O lines allows for versatile connectivity options with external devices, facilitating communication and interaction within a system.

Technical Specifications

Microcontrollers LM3S2410-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2410-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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