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LM3S2139-EQC25-A2

Texas Instruments

LM3S2139-EQC25-A2 by Texas Instruments

LM3S2139-EQC25-A2 by Texas Instruments is a 32-bit microcontroller with 8-bit address bus width, operating at up to 25 MHz. It features 16384 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring a compact form factor with a wide temperature range from -40°C to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,050 parts In-Stock

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8,050

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Digiode

USA . 206 parts In-Stock

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206

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One Stop Electronics

USA . 851 parts In-Stock

1+ parts

$10.000

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851

$10.000

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AZTECH Wire

Italy . 282 parts In-Stock

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$10.737

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282

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Parana Technologies

USA . 2,339 parts In-Stock

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$43.735

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2,339

$43.735

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DigiPath Technology Company

USA . 99 parts In-Stock

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$48.157

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99

$48.157

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ChromeModa Solutions

Germany . 6,320 parts In-Stock

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$49.140

100+ parts

$40.295

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6,320

$49.140

$40.295

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IDEA Electronic Components Group

UK . 378 parts In-Stock

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$49.140

100+ parts

$46.683

1k+ parts

$44.226

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378

$49.140

$46.683

$44.226

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Corphita

USA . 4,740 parts In-Stock

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Microchip USA

USA . 433 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S2139-EQC25-A2 microcontroller by Texas Instruments. Designed with precision and reliability in mind, this product offers unparalleled performance for a wide range of applications. From industrial automation to IoT devices, this microcontroller is your go-to solution for seamless integration and enhanced functionality. Trust in Texas Instruments' reputation for excellence and choose the LM3S2139-EQC25-A2 for all your advanced electronic projects. Elevate your innovation with this top-of-the-line microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller.

Surface Mount: YES

Makes it easy to mount onto circuit boards for efficient assembly.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications.

Address Bus Width: 8

Allows for efficient memory addressing.

Package Shape: SQUARE

Helps in space-saving layout designs.

Bit Size: 32

Supports complex calculations and operations.

Power Supplies (V): 2.5,3.3

Offers flexibility in power input options.

No. of Terminals: 100

Provides ample connectivity options.

Package Style (Meter): FLATPACK

Enhances thermal performance and ease of installation.

Minimum Supply Voltage: 2.25 V

Allows for operation in varied voltage environments.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications with high operating temperatures.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing.

DMA Channels: YES

Supports efficient data transfer for high-performance applications.

Terminal Position: QUAD

Facilitates easy connectivity with other components.

ROM Words: 65536

Offers ample storage capacity for program code.

Maximum Seated Height: 1.6 mm

Allows for compact, low-profile designs.

Width: 14 mm

Compact size for space-constrained applications.

External Data Bus Width: 32

Efficient data transfer capabilities.

Maximum Clock Frequency: 25 MHz

High clock speed for quick processing.

Length: 14 mm

Compact size for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing.

RAM Bytes: 16384

Sufficient memory for data storage and manipulation.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Provides secure soldering connections.

Nominal Supply Voltage: 2.5 V

Stable voltage input for consistent performance.

PWM Channels: YES

Allows for precise control of pulse width modulation.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of code.

Terminal Pitch: 0.5 mm

Fine pitch for compact PCB layouts.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate moisture exposure.

Speed: 25 rpm

Fast processing speed for quick response times.

No. of I/O Lines: 56

Sufficient input and output options for connectivity.

Technical Specifications

Microcontrollers LM3S2139-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2139-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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