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LM3S2110-IBZ25-A2

Texas Instruments

LM3S2110-IBZ25-A2 by Texas Instruments

LM3S2110-IBZ25-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 16384 bytes of RAM and 65536 ROM words, suitable for industrial applications requiring PWM channels and ADC functionality.

Median Price

$53.762

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$53.762

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150

$53.762

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Vyrian

USA . 5,223 parts In-Stock

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Digiode

USA . 3,184 parts In-Stock

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3,184

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Distributors (Availability)

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One Stop Electronics

USA . 204 parts In-Stock

1+ parts

$11.000

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204

$11.000

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AZTECH Wire

Italy . 194 parts In-Stock

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$13.795

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194

$13.795

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Parana Technologies

USA . 749 parts In-Stock

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$34.527

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749

$34.527

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DigiPath Technology Company

USA . 193 parts In-Stock

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$38.018

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193

$38.018

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ChromeModa Solutions

Germany . 2,975 parts In-Stock

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$38.794

100+ parts

$31.811

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2,975

$38.794

$31.811

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IDEA Electronic Components Group

UK . 45 parts In-Stock

1+ parts

$38.794

100+ parts

$36.854

1k+ parts

$34.915

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45

$38.794

$36.854

$34.915

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Microchip USA

USA . 1,302 parts In-Stock

1+ parts

$51.910

100+ parts

$51.170

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$50.800

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$50.430

1,302

$51.910

$51.170

$50.800

$50.430

Component Stockers USA

USA . 667 parts In-Stock

1+ parts

$99.990

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Corphita

USA . 4,723 parts In-Stock

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Overview

Unlock the endless possibilities of innovation with the LM3S2110-IBZ25-A2 microcontroller by Texas Instruments. Renowned for its superior quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this microcontroller offers unmatched value and benefits to customers seeking high performance and efficiency. Elevate your projects with the LM3S2110-IBZ25-A2 and experience the advantages of Texas Instruments' innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability enables easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this microcontroller is energy-efficient and ideal for low power applications.

Package Shape: SQUARE

Square package shape allows for efficient space utilization on the circuit board, maximizing component placement flexibility.

Bit Size: 32

32-bit architecture provides high processing power and efficiency for complex applications, ensuring optimal performance.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V, 3.3V) allows flexibility in design and compatibility with various system requirements.

No. of Terminals: 108

With a high number of terminals, this microcontroller offers plenty of connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style ensures secure and reliable connections between the microcontroller and the PCB, enhancing overall system reliability.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage of 2.25V allows for operation in low power consumption modes, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of 85°C makes this microcontroller suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can withstand cold environments and operate reliably in harsh conditions.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable electrical connections.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly process, making it easier to integrate the microcontroller into the overall system design.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing a significant amount of program code and data, accommodating complex software requirements.

Maximum Seated Height: 1.5 mm

Compact maximum seated height of 1.5mm facilitates low-profile assembly and integration of the microcontroller into space-constrained devices.

Width: 10 mm

Narrow width of 10mm enables efficient placement of the microcontroller on the PCB, optimizing board space utilization.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32MHz delivers fast and responsive performance, suitable for real-time applications and processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Extended maximum time at peak reflow temperature of 30 seconds allows for reliable soldering during assembly, ensuring robust mechanical connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper melting and flow of solder during the assembly process, resulting in strong, enduring solder joints.

Length: 10 mm

Short length of 10mm facilitates compact and space-efficient layout on the PCB, contributing to overall system miniaturization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification guarantees reliable operation in harsh industrial environments with temperature extremes and fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance, low power consumption, and efficient execution of instructions for optimal system operation.

RAM Bytes: 16384

Generous RAM capacity of 16384 bytes provides ample space for data storage and efficient program execution, enhancing system performance and responsiveness.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology offers low power consumption, high noise immunity, and reliable operation for energy-efficient applications.

Terminal Form: BALL

Ball terminal form enables reliable solder connections and facilitates high-density mounting on the PCB, enhancing overall system reliability and performance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable performance of the microcontroller, meeting system voltage requirements.

PWM Channels: YES

Pulse-width modulation (PWM) channels allow precise control of motor speeds, LED brightness, and other applications, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility for updating firmware and software, enabling quick and easy reprogramming without the need for external programming tools.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm allows for high-density mounting on the PCB, maximizing connectivity options and board space efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 designation indicates moderate moisture sensitivity, requiring standard handling and storage precautions to prevent moisture-related damage during assembly.

Speed: 25 rpm

Operates at a speed of 25 rotations per minute, suitable for controlling various motor applications and providing precise control over rotational speed.

No. of I/O Lines: 40

40 I/O lines offer ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers LM3S2110-IBZ25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2110-IBZ25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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