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LM3S2110-EQC25-A2T

Texas Instruments

LM3S2110-EQC25-A2T by Texas Instruments

Texas Instruments' LM3S2110-EQC25-A2T is a 32-bit microcontroller with 40 I/O lines, 16384 RAM bytes, and 65536 ROM words. Operating at -40 to 105 °C, it features PWM channels, ADC support, and a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring a compact design with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,023 parts In-Stock

1+ parts

-

100+ parts

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4,023

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Vyrian

USA . 3,439 parts In-Stock

1+ parts

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100+ parts

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3,439

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 424 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

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10k+ parts

-

424

$5.000

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Parana Technologies

USA . 718 parts In-Stock

1+ parts

$16.438

100+ parts

$1,526.546

1k+ parts

$14.794

10k+ parts

-

718

$16.438

$1,526.546

$14.794

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AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$17.578

100+ parts

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587

$17.578

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DigiPath Technology Company

USA . 970 parts In-Stock

1+ parts

$18.101

100+ parts

$16.653

1k+ parts

-

10k+ parts

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970

$18.101

$16.653

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ChromeModa Solutions

Germany . 6,549 parts In-Stock

1+ parts

$18.470

100+ parts

$15.145

1k+ parts

-

10k+ parts

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6,549

$18.470

$15.145

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IDEA Electronic Components Group

UK . 815 parts In-Stock

1+ parts

$18.470

100+ parts

$17.546

1k+ parts

$16.623

10k+ parts

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815

$18.470

$17.546

$16.623

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Microchip USA

USA . 2,322 parts In-Stock

1+ parts

$46.750

100+ parts

$45.940

1k+ parts

$45.530

10k+ parts

$45.130

2,322

$46.750

$45.940

$45.530

$45.130

Corphita

USA . 1,607 parts In-Stock

1+ parts

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1,607

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Overview

Elevate your projects with the LM3S2110-EQC25-A2T microcontroller from Texas Instruments, a powerhouse in the industry known for top-quality products. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits. With its advanced features and reliable performance, customers can trust in the innovation and efficiency that this product brings to their designs. Upgrade your projects today with the LM3S2110-EQC25-A2T and experience the advantages that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection to the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology provides easy PCB assembly and reduces manufacturing costs.

Maximum Supply Voltage: 2.75 V

Operating at a maximum supply voltage of 2.75V ensures efficient power consumption and reliable performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Bit Size: 32

32-bit architecture offers high performance and processing capabilities for the microcontroller.

Power Supplies (V): 2.5,3.3

Supporting multiple power supply options (2.5V and 3.3V) provides flexibility in designing and integrating the microcontroller.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity and interface options with external components.

Package Style (Meter): FLATPACK

Flatpack package style provides a low-profile design suitable for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Operating at a minimum supply voltage of 2.25V ensures continued functionality even under low power conditions.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the microcontroller can withstand high temperature environments.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C allows the microcontroller to function reliably in cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good electrical conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals for input processing.

Terminal Position: QUAD

Quad terminal position facilitates convenient soldering and assembly on the PCB.

ROM Words: 65536

With 65536 ROM words, the microcontroller can store and retrieve a large amount of program data efficiently.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for compact PCB designs and reduces overall board thickness.

Width: 14 mm

With a width of 14mm, the microcontroller can be easily accommodated in various PCB layouts.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency (0.032 MHz) enables fast processing capabilities and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable solder joints and PCB assembly.

Length: 14 mm

With a length of 14mm, the microcontroller fits well within standard PCB dimensions.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation across a wide range of temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller provides efficient processing and reduced power consumption.

RAM Bytes: 16384

With 16384 RAM bytes, the microcontroller can efficiently store and access data during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for stable operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and ease of assembly on the PCB.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures consistent and stable performance.

PWM Channels: YES

Having PWM channels enables precise control of analog signals for applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming of the microcontroller for firmware updates and customization.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the microcontroller enables high-density mounting on the PCB for space-efficient designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller has a moderate moisture sensitivity level, ensuring proper handling during assembly processes.

Speed: 25 rpm

Operating at a speed of 25 rpm allows for fast processing and response times in real-time applications.

No. of I/O Lines: 40

With 40 I/O lines, the microcontroller offers versatile input/output capabilities for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2110-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2110-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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