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LM3S1Z16-IQR50-C5T

Texas Instruments

LM3S1Z16-IQR50-C5T by Texas Instruments

LM3S1Z16-IQR50-C5T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 6144 bytes of RAM, Flash ROM programmability, and supports ADC and DMA channels. Ideal for industrial applications requiring high-speed processing and precise control with a supply voltage range of 1.2V to 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,289 parts In-Stock

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Digiode

USA . 956 parts In-Stock

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One Stop Electronics

USA . 654 parts In-Stock

1+ parts

$10.000

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654

$10.000

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AZTECH Wire

Italy . 702 parts In-Stock

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$13.837

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702

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Parana Technologies

USA . 311 parts In-Stock

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$76.237

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311

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ChromeModa Solutions

Germany . 3,582 parts In-Stock

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$85.660

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$70.241

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3,582

$85.660

$70.241

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IDEA Electronic Components Group

UK . 1,851 parts In-Stock

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$85.660

100+ parts

$81.377

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$77.094

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1,851

$85.660

$81.377

$77.094

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Corphita

USA . 830 parts In-Stock

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DigiPath Technology Company

USA . 501 parts In-Stock

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$77.231

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Microchip USA

USA . 340 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments LM3S1Z16-IQR50-C5T microcontroller, a cutting-edge solution for a wide range of applications. Crafted with precision and expertise by a trusted manufacturer, this device boasts unrivaled quality and reliability. Seamlessly integrating advanced technology with user-friendly design, this microcontroller offers unparalleled performance and efficiency. Whether you're a seasoned professional or a tech enthusiast, this product is sure to elevate your projects to new heights. Experience the difference with the Texas Instruments LM3S1Z16-IQR50-C5T microcontroller - where excellence meets ingenuity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while still operating within safe voltage limits.

Package Shape: SQUARE

Optimal shape for space-saving on electronic circuit boards.

Bit Size: 32

High bit size allows for complex calculations and processing capabilities.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options for versatility in different applications.

No. of Terminals: 64

Sufficient number of terminals for connectivity and interfacing with other components.

Package Style (Meter): FLATPACK

Compact and efficient package style for space-constrained designs.

Minimum Supply Voltage: 3 V

Operates efficiently at lower supply voltages for power savings.

Maximum Operating Temperature: 85 °C

Industrial-grade temperature range ensures reliable operation in harsh environments.

CPU Family: CORTEX-M3

High-performance CPU family known for its efficiency and versatility in microcontroller applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Provides a durable finish for terminals to ensure reliable connections.

ADC Channels: YES

Integrated ADC channels for analog signal processing and conversion capabilities.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer without CPU intervention.

Terminal Position: QUAD

Quad terminal position allows for easy placement and soldering on PCBs.

ROM Words: 16384

Sufficient ROM memory for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-saving in compact electronic designs.

Width: 10 mm

Compact width for flexibility in board layout and design.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and operation speeds.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow time for efficient soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints and connections.

Length: 10 mm

Compact length for efficient board space utilization.

Temperature Grade: INDUSTRIAL

Designed for industrial applications with high temperature tolerance and reliability.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller peripheral for efficient data processing and control functions.

RAM Bytes: 6144

Adequate RAM memory for data storage and processing tasks.

Technology: CMOS

CMOS technology for low power consumption and efficient operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder joints.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable operation.

PWM Channels: YES

Integrated PWM channels for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updates of program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise soldering and connection on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for safe handling and storage of the microcontroller.

Speed: 50 rpm

Operates at a fast speed for efficient data processing and control tasks.

No. of I/O Lines: 33

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1Z16-IQR50-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1Z16-IQR50-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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