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LM3S1Z16-IQR50-C3T

Texas Instruments

LM3S1Z16-IQR50-C3T by Texas Instruments

LM3S1Z16-IQR50-C3T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 50 MHz. It features 6144 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,530 parts In-Stock

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5,530

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Digiode

USA . 4,456 parts In-Stock

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4,456

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 780 parts In-Stock

1+ parts

$12.012

100+ parts

-

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780

$12.012

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One Stop Electronics

USA . 1,429 parts In-Stock

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$16.000

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1,429

$16.000

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Parana Technologies

USA . 172 parts In-Stock

1+ parts

$33.199

100+ parts

$3,083.010

1k+ parts

$29.879

10k+ parts

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172

$33.199

$3,083.010

$29.879

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DigiPath Technology Company

USA . 43 parts In-Stock

1+ parts

$36.556

100+ parts

$33.631

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-

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43

$36.556

$33.631

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ChromeModa Solutions

Germany . 6,884 parts In-Stock

1+ parts

$37.302

100+ parts

$30.588

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6,884

$37.302

$30.588

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IDEA Electronic Components Group

UK . 665 parts In-Stock

1+ parts

$37.302

100+ parts

$35.437

1k+ parts

$33.572

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665

$37.302

$35.437

$33.572

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Corphita

USA . 4,765 parts In-Stock

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4,765

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Microchip USA

USA . 218 parts In-Stock

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Overview

Unlock limitless possibilities with the LM3S1Z16-IQR50-C3T microcontroller by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers reliable products that exceed expectations. Perfect for a wide range of applications, this microcontroller offers unmatched performance, flexibility, and efficiency. Experience seamless operation, advanced features, and exceptional value with the LM3S1Z16-IQR50-C3T, setting new standards in the world of microcontrollers. Elevate your projects to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact design, saving space on the PCB and making assembly easier.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32V ensures safe operation and protects the microcontroller from potential damage due to overvoltage.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and processing tasks efficiently.

Power Supplies (V): 1.2,3.3

Support for multiple power supply options (1.2V and 3.3V) allows for flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external components and peripherals.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the microcontroller to perform reliably in extreme cold conditions.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, making the microcontroller suitable for sensor interfacing and data acquisition applications.

RAM Bytes: 6144

With 6144 bytes of RAM, the microcontroller can efficiently store and manipulate data during program execution.

ROM Programmability: FLASH

The use of FLASH ROM allows for easy programmability and reprogramming of the microcontroller, enhancing flexibility and ease of development.

Technical Specifications

Microcontrollers LM3S1Z16-IQR50-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1Z16-IQR50-C3T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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