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LM3S1W16-IQR50-C5

Texas Instruments

LM3S1W16-IQR50-C5 by Texas Instruments

LM3S1W16-IQR50-C5 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 8192 bytes of RAM, Flash ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,245 parts In-Stock

1+ parts

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6,245

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Digiode

USA . 3,498 parts In-Stock

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3,498

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 625 parts In-Stock

1+ parts

$6.966

100+ parts

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625

$6.966

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Parana Technologies

USA . 1,800 parts In-Stock

1+ parts

$14.138

100+ parts

-

1k+ parts

$14.598

10k+ parts

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1,800

$14.138

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$14.598

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DigiPath Technology Company

USA . 1,831 parts In-Stock

1+ parts

$15.567

100+ parts

$14.322

1k+ parts

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1,831

$15.567

$14.322

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ChromeModa Solutions

Germany . 4,021 parts In-Stock

1+ parts

$15.885

100+ parts

$13.026

1k+ parts

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4,021

$15.885

$13.026

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IDEA Electronic Components Group

UK . 1,187 parts In-Stock

1+ parts

$15.885

100+ parts

$15.091

1k+ parts

$14.296

10k+ parts

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1,187

$15.885

$15.091

$14.296

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One Stop Electronics

USA . 449 parts In-Stock

1+ parts

$17.000

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449

$17.000

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Corphita

USA . 4,966 parts In-Stock

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4,966

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Microchip USA

USA . 169 parts In-Stock

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169

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Overview

Unleash the power of innovation with the LM3S1W16-IQR50-C5 microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability in their products. The LM3S1W16-IQR50-C5 is perfect for a wide range of applications, offering customers unparalleled value and benefits. Whether you're designing advanced electronics or creating cutting-edge IoT devices, this microcontroller provides the performance and efficiency you need to bring your ideas to life. Elevate your projects with the LM3S1W16-IQR50-C5 and experience the difference that Texas Instruments technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy body material provides durability and ensures the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for versatile input power options.

Package Shape: SQUARE

Square package shape allows for compact and efficient PCB design.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities for the microcontroller.

Power Supplies (V): 1.2, 3.3

Multiple power supply options provide flexibility and compatibility with different circuits.

No. of Terminals: 64

High number of terminals allow for connectivity to a wide range of external components.

Package Style (Meter): FLATPACK

Flatpack package style offers low profile and space-saving design.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the microcontroller suitable for industrial applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and solderability.

ADC Channels: YES

Analog-to-digital converter channels enable interfacing with analog sensors and signals.

DMA Channels: YES

Direct memory access channels allow for efficient data transfer without CPU intervention.

Terminal Position: QUAD

Quad terminal position enables stable and secure mounting on the PCB.

ROM Words: 32768

Large ROM memory capacity allows for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low seated height makes the microcontroller suitable for slim and compact device designs.

Width: 10 mm

Compact width dimensions facilitate efficient PCB layout and space utilization.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency supports fast and responsive operation.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and component reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for lead-free soldering and RoHS compliance.

Length: 10 mm

Compact length dimensions contribute to space-saving and compact device designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller peripheral IC type provides integrated functionality for various applications.

RAM Bytes: 8192

Sufficient RAM memory capacity for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides reliable and secure connection to the PCB.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance and operation.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB layout and miniaturization.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing environments.

Speed: 50 rpm

Operating speed of 50 rpm ensures fast and efficient processing of instructions.

No. of I/O Lines: 33

Abundance of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1W16-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1W16-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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