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LM3S1W16-IQR50-C1

Texas Instruments

LM3S1W16-IQR50-C1 by Texas Instruments

LM3S1W16-IQR50-C1 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 0.032 MHz. It features 8192 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,818 parts In-Stock

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5,818

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Digiode

USA . 1,687 parts In-Stock

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1,687

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 332 parts In-Stock

1+ parts

$7.652

100+ parts

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332

$7.652

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Parana Technologies

USA . 258 parts In-Stock

1+ parts

$17.478

100+ parts

$1,623.081

1k+ parts

$15.730

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258

$17.478

$1,623.081

$15.730

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DigiPath Technology Company

USA . 2,247 parts In-Stock

1+ parts

$19.245

100+ parts

$17.706

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2,247

$19.245

$17.706

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ChromeModa Solutions

Germany . 5,440 parts In-Stock

1+ parts

$19.638

100+ parts

$16.103

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5,440

$19.638

$16.103

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IDEA Electronic Components Group

UK . 1,120 parts In-Stock

1+ parts

$19.638

100+ parts

$18.656

1k+ parts

$17.674

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1,120

$19.638

$18.656

$17.674

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One Stop Electronics

USA . 1,565 parts In-Stock

1+ parts

$33.000

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1,565

$33.000

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Corphita

USA . 3,977 parts In-Stock

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Microchip USA

USA . 421 parts In-Stock

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Overview

Experience the next level of innovation with the LM3S1W16-IQR50-C1 by Texas Instruments. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this versatile product provides customers with exceptional value, benefits, and advantages. Unlock endless possibilities with the LM3S1W16-IQR50-C1 and take your projects to new heights today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and less prone to damage during handling or operation.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and enabling efficient production processes.

Maximum Supply Voltage: 1.32 V

With a relatively low maximum supply voltage, this microcontroller can operate efficiently while consuming less power.

Package Shape: SQUARE

The square shape of the package provides a convenient form factor for mounting and integration into various electronic devices.

Bit Size: 32

A 32-bit architecture allows for high processing power and performance, suitable for handling complex tasks and calculations.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with different power sources.

No. of Terminals: 64

Having a higher number of terminals allows for more connections and interfaces, expanding the capabilities and versatility of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile and compact design, suitable for applications where space is limited.

Minimum Supply Voltage: 1.08 V

A low minimum supply voltage ensures that the microcontroller can operate efficiently even with lower power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this microcontroller suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments or during start-up conditions.

ADC Channels: YES

Having ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with sensors and external signals.

DMA Channels: YES

Integrated DMA channels facilitate efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection, ensuring reliable operation and signal integrity.

ROM Words: 32768

With a large ROM capacity, this microcontroller can store a significant amount of program data and instructions for various applications.

Maximum Seated Height: 1.6 mm

The low seated height allows for a slim profile and compact design, making it suitable for devices with space constraints.

Width: 10 mm

The narrow width of the microcontroller facilitates easy mounting on circuit boards and integration into various electronic systems.

Maximum Clock Frequency: 0.032 MHz

The high clock frequency supports fast data processing and execution of instructions, enhancing the overall performance of the microcontroller.

Length: 10 mm

The compact length of the microcontroller makes it suitable for applications where space is limited without compromising functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operations, this microcontroller can withstand harsh environmental conditions and ensure reliable performance in demanding applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller means that this product is specifically designed for embedded systems and control applications, offering integrated peripherals and processing capabilities.

RAM Bytes: 8192

With a generous RAM capacity, this microcontroller can efficiently store and access data during runtime, enabling smooth and responsive operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and secure connection, ensuring stable performance and signal integrity in demanding conditions.

Nominal Supply Voltage: 1.2 V

A stable nominal supply voltage ensures consistent and reliable operation of the microcontroller without risking damage or performance issues.

PWM Channels: YES

Having PWM channels allows for precise control of analog signals and outputs, essential for tasks such as motor control and power modulation.

ROM Programmability: FLASH

Flash programmability enables easy and convenient updates to the microcontroller's firmware and software, ensuring flexibility and adaptability in applications.

Terminal Pitch: 0.5 mm

The narrow terminal pitch allows for high-density mounting on circuit boards, saving space and enabling compact designs.

Speed: 50 rpm

With a speed of 50 rpm, this microcontroller can handle data processing and computations swiftly, ensuring efficient performance in real-time applications.

No. of I/O Lines: 33

Having multiple I/O lines provides ample connectivity and interfacing options, allowing for versatile and customizable functionality in the end product.

Technical Specifications

Microcontrollers LM3S1W16-IQR50-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1W16-IQR50-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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