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LM3S1R26-IQR80-C5T

Texas Instruments

LM3S1R26-IQR80-C5T by Texas Instruments

LM3S1R26-IQR80-C5T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 49152 RAM bytes. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring high-speed processing. With features like ADC and PWM channels, this microcontroller offers versatile functionality in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,606 parts In-Stock

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5,606

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Digiode

USA . 2,136 parts In-Stock

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2,136

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Distributors (Availability)

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One Stop Electronics

USA . 1,247 parts In-Stock

1+ parts

$1.000

100+ parts

-

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1,247

$1.000

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AZTECH Wire

Italy . 562 parts In-Stock

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$19.837

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562

$19.837

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Parana Technologies

USA . 458 parts In-Stock

1+ parts

$35.682

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458

$35.682

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ChromeModa Solutions

Germany . 6,400 parts In-Stock

1+ parts

$40.092

100+ parts

$32.875

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6,400

$40.092

$32.875

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IDEA Electronic Components Group

UK . 685 parts In-Stock

1+ parts

$40.092

100+ parts

$38.087

1k+ parts

$36.083

10k+ parts

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685

$40.092

$38.087

$36.083

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Corphita

USA . 4,549 parts In-Stock

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4,549

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DigiPath Technology Company

USA . 2,063 parts In-Stock

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$36.147

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2,063

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$36.147

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Microchip USA

USA . 338 parts In-Stock

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338

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Overview

Elevate your projects with the LM3S1R26-IQR80-C5T microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products, making this microcontroller an essential component for a wide range of applications. With its advanced features and capabilities, this microcontroller offers unmatched value and benefits to customers looking to streamline their projects and achieve superior performance. Take your designs to the next level with the LM3S1R26-IQR80-C5T microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle relatively high voltages, making it versatile for a variety of applications.

Bit Size: 32

Offers a good balance between processing power and efficiency.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 64

Provides ample connectivity options for peripherals and external components.

Package Style (Meter): FLATPACK

Allows for compact and efficient packaging of the microcontroller.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperatures may be encountered.

CPU Family: CORTEX-M3

Utilizes a powerful and energy-efficient processor architecture.

ROM Words: 262144

Offers ample storage space for program code and data.

Width: 14 mm

Compact size for integration into smaller devices or designs.

Maximum Clock Frequency: 16 MHz

Provides a balance between processing speed and power consumption.

Temperature Grade: INDUSTRIAL

Ideal for harsh environments where temperature fluctuations are common.

RAM Bytes: 49152

Sufficient memory for temporary data storage and processing.

ROM Programmability: FLASH

Allows for easy reprogramming and updating of the microcontroller's firmware.

Moisture Sensitivity Level (MSL): 3

Ensures reliability even in humid or moisture-prone environments.

Technical Specifications

Microcontrollers LM3S1R26-IQR80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1R26-IQR80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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