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LM3S1R26-IQR80-C5

Texas Instruments

LM3S1R26-IQR80-C5 by Texas Instruments

LM3S1R26-IQR80-C5 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 49152 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and control capabilities. With features like ADC and PWM channels, it offers versatile functionality in compact dimensions (14mm x 14mm) ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,906 parts In-Stock

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Digiode

USA . 2,265 parts In-Stock

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2,265

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Distributors (Availability)

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One Stop Electronics

USA . 474 parts In-Stock

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$18.000

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474

$18.000

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AZTECH Wire

Italy . 473 parts In-Stock

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$18.959

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473

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Parana Technologies

USA . 569 parts In-Stock

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$63.785

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569

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DigiPath Technology Company

USA . 2,006 parts In-Stock

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$70.235

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$64.616

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2,006

$70.235

$64.616

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IDEA Electronic Components Group

UK . 1,695 parts In-Stock

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$71.668

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$68.085

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$64.501

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1,695

$71.668

$68.085

$64.501

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ChromeModa Solutions

Germany . 271 parts In-Stock

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$71.668

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$58.768

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271

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$58.768

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Lixinc

USA . 9,264 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Corphita

USA . 4,126 parts In-Stock

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Assy Fe

Spain . 1,410 parts In-Stock

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Futuretech Components

Singapore . 479 parts In-Stock

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479

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Microchip USA

USA . 465 parts In-Stock

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465

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RC Electronics

USA . 179 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S1R26-IQR80-C5 microcontroller by Texas Instruments. Built with precision and expertise, this device offers unparalleled performance and reliability for a wide range of applications. Whether you are a seasoned professional or a hobbyist, this microcontroller provides value beyond compare. From industrial automation to consumer electronics, the possibilities are endless. Experience seamless integration, superior functionality, and innovative solutions with the LM3S1R26-IQR80-C5. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and heat resistance, ensuring the longevity of the product.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options, making it versatile for various applications.

Bit Size: 32

32-bit architecture enables efficient processing and performance for complex tasks.

No. of Terminals: 64

Having 64 terminals allows for multiple connections and interfaces, enhancing connectivity options.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures compatibility with a wide range of software and development tools, making it easy to work with.

ROM Words: 262144

Large ROM size allows for storing extensive program code, making it suitable for applications requiring significant memory storage.

RAM Bytes: 49152

Ample RAM capacity allows for efficient data processing and multitasking capabilities.

Technical Specifications

Microcontrollers LM3S1R26-IQR80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1R26-IQR80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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