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LM3S1R21-IQC80-C3T

Texas Instruments

LM3S1R21-IQC80-C3T by Texas Instruments

LM3S1R21-IQC80-C3T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 49152 RAM bytes. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring high-speed processing and control. With features like ADC and DMA channels, this microcontroller offers versatile functionality for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,928 parts In-Stock

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Vyrian

USA . 3,995 parts In-Stock

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3,995

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Distributors (Availability)

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AZTECH Wire

Italy . 539 parts In-Stock

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$7.518

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539

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One Stop Electronics

USA . 1,134 parts In-Stock

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$24.000

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$24.000

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Parana Technologies

USA . 1,523 parts In-Stock

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$59.895

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$59.895

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DigiPath Technology Company

USA . 2,040 parts In-Stock

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$65.952

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$60.676

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2,040

$65.952

$60.676

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ChromeModa Solutions

Germany . 2,362 parts In-Stock

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$67.298

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$55.184

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2,362

$67.298

$55.184

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IDEA Electronic Components Group

UK . 1,323 parts In-Stock

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$67.298

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$63.933

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$60.568

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1,323

$67.298

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$60.568

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Corphita

USA . 1,000 parts In-Stock

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Microchip USA

USA . 349 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S1R21-IQC80-C3T microcontroller by Texas Instruments. Designed with precision and reliability in mind, this product is at the forefront of technology, offering endless possibilities for applications in various industries. From automation to IoT devices, Texas Instruments' microcontrollers are known for their quality and performance. Experience seamless operation, robust features, and unmatched value with the LM3S1R21-IQC80-C3T. Embrace the future of technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and resources.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power options for the device.

Bit Size: 32

A larger bit size allows for more complex data processing and better performance.

Power Supplies (V): 1.2,3.3

Multiple power supply options allow for compatibility with different power sources and voltage levels.

No. of Terminals: 100

Having a high number of terminals offers more connectivity options and flexibility for interfacing with other components.

Package Style (Meter): FLATPACK

The flatpack design saves space on the PCB and allows for denser and more compact circuit layouts.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to be used in extreme environmental conditions.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels reduce the CPU load and improve data transfer efficiency.

ROM Words: 262144

The large ROM capacity allows for storing a significant amount of program code and data.

Maximum Clock Frequency: 16 MHz

Higher clock frequency results in faster operation and better performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is specifically designed for embedded applications with integrated peripherals for added functionality.

RAM Bytes: 49152

Generous RAM capacity enables efficient data manipulation and processing in real-time applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various voltage levels.

Nominal Supply Voltage: 3.3 V

Consistent supply voltage minimizes the risk of voltage fluctuations impacting the performance of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog signals, ideal for motor control and power regulation.

ROM Programmability: FLASH

Flash programmable ROM enables fast and easy updates of the software without the need for external programming tools.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand exposure to moderate levels of moisture during storage and handling.

No. of I/O Lines: 67

Having a high number of I/O lines allows for versatile interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1R21-IQC80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1R21-IQC80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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