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LM3S1P51-IQC80-C3T

Texas Instruments

LM3S1P51-IQC80-C3T by Texas Instruments

LM3S1P51-IQC80-C3T by Texas Instruments is a 32-bit microcontroller with 67 I/O lines, 24576 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 16 MHz and has PWM and ADC channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,830 parts In-Stock

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8,830

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Digiode

USA . 4,824 parts In-Stock

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4,824

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Distributors (Availability)

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AZTECH Wire

Italy . 267 parts In-Stock

1+ parts

$9.662

100+ parts

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267

$9.662

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One Stop Electronics

USA . 702 parts In-Stock

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$28.000

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702

$28.000

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Parana Technologies

USA . 1,094 parts In-Stock

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$51.937

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1,094

$51.937

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ChromeModa Solutions

Germany . 2,338 parts In-Stock

1+ parts

$58.356

100+ parts

$47.852

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2,338

$58.356

$47.852

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IDEA Electronic Components Group

UK . 1,319 parts In-Stock

1+ parts

$58.356

100+ parts

$55.438

1k+ parts

$52.520

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1,319

$58.356

$55.438

$52.520

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Corphita

USA . 2,121 parts In-Stock

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2,121

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DigiPath Technology Company

USA . 1,532 parts In-Stock

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$52.614

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1,532

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$52.614

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Microchip USA

USA . 287 parts In-Stock

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287

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Overview

Discover the LM3S1P51-IQC80-C3T by Texas Instruments, a top-of-the-line microcontroller that offers unparalleled quality and reliability. With Texas Instruments as the manufacturer, you can trust in the excellence and innovation that this product provides. Ideal for a wide range of applications, this microcontroller delivers exceptional performance and efficiency. Experience seamless integration and enhanced functionality with the LM3S1P51-IQC80-C3T, making it the perfect choice for your next project. Upgrade your technology with this cutting-edge microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and protection for the microcontroller chip inside.

Surface Mount: YES

Surface mount capability makes it easier to integrate this microcontroller into a circuit board.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V allows for compatibility with various power sources.

Package Shape: SQUARE

Square package shape makes it easy to fit into a compact design.

Bit Size: 32

32-bit size allows for processing of larger data sets and more complex algorithms.

Power Supplies (V): 1.2, 3.3

Supporting multiple power supply voltages gives flexibility in design and power management.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for peripherals and external devices.

ADC Channels: YES

Analog to Digital Converter channels enable the microcontroller to read analog signals from sensors.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between memory and peripherals.

ROM Words: 65536

With 65536 ROM words, the microcontroller can store a large amount of program instructions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed to control various electronic devices and systems.

RAM Bytes: 24576

24,576 RAM bytes provide space for storing and manipulating data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog outputs such as motor speed or LED brightness.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and modifications without the need for external programming tools.

Technical Specifications

Microcontrollers LM3S1P51-IQC80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1P51-IQC80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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