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LM3S1N16-IQR50-C1T

Texas Instruments

LM3S1N16-IQR50-C1T by Texas Instruments

LM3S1N16-IQR50-C1T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 0.032 MHz. It features 33 I/O lines, ADC and DMA channels, and 12288 bytes of RAM. Ideal for industrial applications requiring high-speed processing and precise control in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,043 parts In-Stock

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6,043

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Digiode

USA . 1,577 parts In-Stock

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1,577

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Distributors (Availability)

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One Stop Electronics

USA . 130 parts In-Stock

1+ parts

$4.000

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130

$4.000

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AZTECH Wire

Italy . 501 parts In-Stock

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$5.676

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501

$5.676

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Parana Technologies

USA . 2,264 parts In-Stock

1+ parts

$43.643

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2,264

$43.643

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DigiPath Technology Company

USA . 88 parts In-Stock

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$48.056

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88

$48.056

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ChromeModa Solutions

Germany . 1,559 parts In-Stock

1+ parts

$49.037

100+ parts

$40.210

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1,559

$49.037

$40.210

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IDEA Electronic Components Group

UK . 1,554 parts In-Stock

1+ parts

$49.037

100+ parts

$46.585

1k+ parts

$44.133

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1,554

$49.037

$46.585

$44.133

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Corphita

USA . 1,655 parts In-Stock

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Microchip USA

USA . 288 parts In-Stock

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Overview

Experience the power of innovation with the LM3S1N16-IQR50-C1T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. With advanced features such as ADC channels, PWM channels, and DMA channels, the LM3S1N16-IQR50-C1T is the perfect solution for all your microcontroller needs. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Ease of installation and versatile mounting options.

Maximum Supply Voltage: 1.32 V

Allows for efficient power management and helps prevent damage from voltage spikes.

Package Shape: SQUARE

Compact design that saves space on the PCB.

Bit Size: 32

Higher bit size allows for more complex operations and calculations.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options for flexibility in different applications.

No. of Terminals: 64

Sufficient terminals for connecting peripherals and components.

Package Style (Meter): FLATPACK

Low-profile package style for space-constrained designs.

Minimum Supply Voltage: 1.08 V

Allows for operation at lower power levels to conserve energy.

Maximum Operating Temperature: 85 °C

Wide temperature range for operation in industrial environments.

ADC Channels: YES

Analog-to-digital conversion capability for interfacing with analog sensors.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position for easy PCB layout and connections.

ROM Words: 65536

Ample memory capacity for program storage and data handling.

Maximum Seated Height: 1.6 mm

Low-profile design for space-saving applications.

Width: 10 mm

Compact width for fitting into tight spaces on the PCB.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for rapid processing of instructions.

Length: 10 mm

Compact length for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial operating conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications.

RAM Bytes: 12288

Sufficient RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and connection reliability.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation channels for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB designs.

Speed: 50 rpm

Operating speed suitable for a wide range of applications.

No. of I/O Lines: 33

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1N16-IQR50-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1N16-IQR50-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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