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LM3S1N11-IQC50-C3

Texas Instruments

LM3S1N11-IQC50-C3 by Texas Instruments

LM3S1N11-IQC50-C3 by Texas Instruments is a 32-bit microcontroller with 12288 bytes of RAM and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and DMA channels. With a package style of FLATPACK and GULL WING terminal form, it offers 67 I/O lines in a compact design for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,854 parts In-Stock

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2,854

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Vyrian

USA . 2,389 parts In-Stock

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2,389

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Distributors (Availability)

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AZTECH Wire

Italy . 880 parts In-Stock

1+ parts

$9.972

100+ parts

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880

$9.972

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One Stop Electronics

USA . 751 parts In-Stock

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$22.000

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751

$22.000

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Parana Technologies

USA . 83 parts In-Stock

1+ parts

$73.479

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83

$73.479

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ChromeModa Solutions

Germany . 1,037 parts In-Stock

1+ parts

$82.561

100+ parts

$67.700

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1,037

$82.561

$67.700

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IDEA Electronic Components Group

UK . 744 parts In-Stock

1+ parts

$82.561

100+ parts

$78.433

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$74.305

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744

$82.561

$78.433

$74.305

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QUARKTWIN TECHNOLOGY LTD

USA . 10,712 parts In-Stock

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Glotronic Ltd.

UK . 9,000 parts In-Stock

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Microchip USA

USA . 5,509 parts In-Stock

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5,509

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DigiPath Technology Company

USA . 2,209 parts In-Stock

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$74.437

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2,209

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$74.437

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Corphita

USA . 1,160 parts In-Stock

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1,160

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A-Z Elektronik GmbH

Germany . 429 parts In-Stock

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429

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Metaverse IC Inc.

Canada . 386 parts In-Stock

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Kepictronics

USA . 286 parts In-Stock

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286

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Overview

Unleash the power of innovation with the Texas Instruments LM3S1N11-IQC50-C3 microcontroller! Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. With its advanced features and high-quality materials, this microcontroller is the perfect choice for those seeking superior functionality and value. Elevate your projects to new heights with the industry-leading technology and efficiency of the Texas Instruments LM3S1N11-IQC50-C3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and heat-resistant housing for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on a PCB, saving time during manufacturing.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a safe voltage range, reducing the risk of damage to the microcontroller.

Package Shape: SQUARE

Facilitates compact and space-saving PCB design, ideal for applications with limited space.

Bit Size: 32

Offers high processing capability and performance for complex tasks and applications.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, allowing flexibility in different application requirements.

No. of Terminals: 100

Provides ample connection points for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Enables easy placement and soldering on the PCB, enhancing the overall manufacturing efficiency.

Minimum Supply Voltage: 1.08 V

Ensures reliable operation even at lower voltage levels, extending the product's lifespan.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

Supports direct memory access for efficient data transfer between peripherals and memory, improving system performance.

Terminal Position: QUAD

Facilitates easy PCB layout and routing, simplifying the design process.

ROM Words: 65536

Offers a large memory capacity for storing program instructions and data, essential for complex applications.

Maximum Seated Height: 1.6 mm

Ensures compatibility with compact enclosure designs, making it suitable for space-constrained applications.

Width: 14 mm

Compact size allows for versatile placement on the PCB, optimizing board real estate.

Maximum Clock Frequency: 0.032 MHz

Supports high-speed operation for demanding applications, delivering superior performance.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands reflow soldering processes, ensuring reliable and robust solder connections during assembly.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes, meeting industry standards for manufacturing.

Length: 14 mm

Compact form factor contributes to space-efficient PCB design, ideal for miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments, meeting stringent performance and reliability requirements.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring optimized performance and functionality.

RAM Bytes: 12288

Offers ample random access memory for data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, maximizing energy efficiency.

Terminal Form: GULL WING

Facilitates easy soldering on the PCB, ensuring reliable electrical connections and smooth assembly.

Nominal Supply Voltage: 1.2 V

Operates at an efficient voltage level, minimizing power consumption and heat dissipation.

PWM Channels: YES

Supports pulse width modulation for precise control over connected devices, ideal for motor control and power management.

ROM Programmability: FLASH

Features flash memory for easy programmability and updates, allowing for quick and convenient firmware revisions.

Terminal Pitch: 0.5 mm

Provides fine pitch spacing for high-density PCB layouts, enabling compact and space-saving designs.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, suitable for a wide range of operating environments.

Speed: 50 rpm

Supports high-speed operation for quick processing of data and tasks, ensuring efficient performance.

No. of I/O Lines: 67

Offers a sufficient number of input/output lines for connecting external devices and peripherals, enhancing system flexibility and expandability.

Technical Specifications

Microcontrollers LM3S1N11-IQC50-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1N11-IQC50-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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